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3Time-Domain Simulation Based Multi-Domain Optimization of Gallium Nitride-Based DC/DC Converters utilizing Spice Models
J. Nuzzo, D. Koch, M. Bosch, T. Fink, and I. Kallfass. CIPS 2024 : 13th International Conference on Integrated Power Electronics Systems, page 654-660. Berlin, VDE Verlag, (2024)
4 months ago by @unibiblio
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3Technique for Measuring the Capacitance-Voltage Characteristics of GaN and SiC Bidirectional Power Switches
M. Bosch, D. Koch, J. Nuzzo, and I. Kallfass. CIPS 2024 : 13th International Conference on Integrated Power Electronics Systems, page 208-212. Berlin, VDE Verlag, (2024)
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3PCB-Integrated Pickup-Coil for Overcurrent Detection in High-Current, Paralleled GaN HEMTs
D. Koch, T. Fink, J. Nuzzo, K. Barón, and I. Kallfass. 2024 IEEE Applied Power Electronics Conference and Exposition (APEC), page 555-560. IEEE, (2024)
7 months ago by @unibiblio
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3Gate-Source-Dependent Soft- and Hard-Switching Losses of 1200V SiC MOSFETs Utilizing Heatsinkless Calorimetric Measurements Based on Optical Sensors
R. Schnitzler, D. Koch, M. Weiser, J. Weimer, and I. Kallfass. 2024 IEEE Applied Power Electronics Conference and Exposition (APEC), page 1100-1107. IEEE, (2024)
7 months ago by @unibiblio
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2Hybrid Model of Power MOSFET for Soft Failures Estimation Based on Time Domain Reflectometry and Machine Learning
V. Afanasenko, K. Sharma, S. Kamm, and I. Kallfass. Green world with power electronics : ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - ECCE Asia, May 22 (Mon.)-25 (Thu.), 2023, ICC Jeju, Jeju, Korea, page 1849-1854. IEEE, (2023)
7 months ago by @unibiblio
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4Optimized Design of Fast-Switching GaN-based Inverters Utilizing a Digital Prototype in a Standardized Realistic Test Cycle
J. Nuzzo, D. Koch, M. Weiser, M. Bosch, R. Schnitzler, and I. Kallfass. 2023 IEEE Design Methodologies Conference (DMC), IEEE, (2023)
9 months ago by @unibiblio
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3Fully Modular, Dynamic SiC and GaN Testbench with Automated Temperature and Gate-Voltage Characterization
R. Schnitzler, D. Koch, E. Dos Santos Gomes, and I. Kallfass. 2023 IEEE Design Methodologies Conference (DMC), IEEE, (2023)
9 months ago by @unibiblio
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4Highly-Integrated, Low-Noise, Dual-Output GaN DC/DC for GaN Solid State Power Amplifier Supplies in Space Applications
D. Koch, J. Nuzzo, M. Bosch, M. Rueß, D. Wrana, B. Schoch, and I. Kallfass. 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA), IEEE, (2023)
9 months ago by @unibiblio
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3Digital Twin for Gate-Resistor Optimization of Parallel, 100 V, 7 mΩ, GaN HEMTs based on Comprehensive Multi-Domain Simulations and Physically-Motivated Transistor Models
D. Koch, J. Nuzzo, M. Weiser, and I. Kallfass. 2023 IEEE Design Methodologies Conference (DMC), IEEE, (2023)
9 months ago by @unibiblio
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2Multi-MHz Auto-Resonant Power Oscillator in a 650 V GaN-on-SOI Technology for Compact Wireless Power Transfer Systems
M. Rueß, D. Koch, and I. Kallfass. 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA), (2023)
9 months ago by @unibiblio
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3Characterization of Threshold Voltage for Application-Oriented Power Cycling Conditions for Wide-Bandgap Power Devices
K. Munoz Barón, K. Sharma, M. Nitzsche, P. Ziegler, D. Koch, and I. Kallfass. PCIM Europe digital days 2020 : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, page 1344-1350. Frankfurt am Main, VDE Verlag, (2020)
a year ago by @unibiblio
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4Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter
K. Sharma, K. Muñoz Barón, J. Ruthardt, J. Hueckelheim, D. Koch, F. Muenzenmayer, and I. Kallfass. CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems, page 386-391. Berlin, VDE Verlag, (2020)
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2Application-Oriented Characterization of Thermally Optimized, Asymmetrical Single Chip Packages for 100 V GaN HEMTs
D. Koch, V. Polezhaev, A. Sharma, K. Munoz Baron, T. Huesgen, and I. Kallfass. 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD), page 48-51. IEEE, (2023)
a year ago by @unibiblio
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1Ultra-High Throughput E/W-Band Downlink CubeSat Mission
L. Manoliu, S. Haußmann, B. Schoch, J. Wörmann, D. Wrana, M. Koller, L. Loidold, J. Meier, R. Müller, A. Tessmann and 8 other author(s). IAF Space Communications and Navigation Symposium, Red Hook, Curran Associates, Inc., (2023)
a year ago by @unibiblio
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1The EIVE CubeSat : Developing a Satellite Bus for a 71-76 GHz E-Band Transmitter Payload
M. Koller, L. Loidold, T. Löffler, J. Meier, S. Klinkner, L. Manoliu, B. Schoch, and I. Kallfass. 2021 - Mission operations & autonomy, Logan, Utah State University, (2021)
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2Online Health Monitoring in Power Modules for Inverter Topologies using Isolated Parameter Acquisition
K. Muñoz Barón, K. Sharma, M. Nitzsche, and I. Kallfass. 2021 IEEE Design Methodologies Conference (DMC), IEEE, (2021)
3 years ago by @unibiblio
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3Compact Half-Bridge Module for a Charger Application Utilizing GaN Power Devices with Integrated Driver
J. Weimer, D. Koch, and I. Kallfass. PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, page 2027-2034. VDE, (2022)
3 years ago by @unibiblio
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2Dynamic Thermal Design of an Active Power Cycling Test Bench for SiC MOSFETs
M. Nitzsche, P. Ziegler, A. Michelberger, K. Muñoz Barón, J. Ruthardt, and J. Roth-Stielow. 2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe), Piscataway, IEEE, (2021)
3 years ago by @unibiblio
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3High thermal conductance AlN power module with hybrid integrated gate drivers and SiC trench MOSFETs for 2 kW single-phase PV inverter
S. Moench, M. Costa, A. Barner, J. Weimer, R. Holz, E. Schwindt, M. Zehelein, J. Roth-Stielow, and I. Kallfass. 2016 18th European Conference on Power Electronics and Applications (EPE16 ECCE Europe) - Karlsruhe, Germany, IEEE, (2016)
6 years ago by @unibiblio
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3Device performance tuning of Ge gate-all-around tunneling field effect transistors by means of GeSn: Potential and challenges
E. Rolseth, A. Blech, I. Fischer, Y. Hashad, R. Koerner, K. Kostecki, A. Kruglov, V. Srinivasan, M. Weiser, T. Wendav and 2 other author(s). 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO), page 57-65. IEEE, (2017)
6 years ago by @unibiblio
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3Time-Domain Simulation Based Multi-Domain Optimization of Gallium Nitride-Based DC/DC Converters utilizing Spice Models

3Technique for Measuring the Capacitance-Voltage Characteristics of GaN and SiC Bidirectional Power Switches

3PCB-Integrated Pickup-Coil for Overcurrent Detection in High-Current, Paralleled GaN HEMTs

3Gate-Source-Dependent Soft- and Hard-Switching Losses of 1200V SiC MOSFETs Utilizing Heatsinkless Calorimetric Measurements Based on Optical Sensors

2Hybrid Model of Power MOSFET for Soft Failures Estimation Based on Time Domain Reflectometry and Machine Learning

4Optimized Design of Fast-Switching GaN-based Inverters Utilizing a Digital Prototype in a Standardized Realistic Test Cycle

3Fully Modular, Dynamic SiC and GaN Testbench with Automated Temperature and Gate-Voltage Characterization

4Highly-Integrated, Low-Noise, Dual-Output GaN DC/DC for GaN Solid State Power Amplifier Supplies in Space Applications

3Digital Twin for Gate-Resistor Optimization of Parallel, 100 V, 7 mΩ, GaN HEMTs based on Comprehensive Multi-Domain Simulations and Physically-Motivated Transistor Models

2Multi-MHz Auto-Resonant Power Oscillator in a 650 V GaN-on-SOI Technology for Compact Wireless Power Transfer Systems

3Characterization of Threshold Voltage for Application-Oriented Power Cycling Conditions for Wide-Bandgap Power Devices

4Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter

2Application-Oriented Characterization of Thermally Optimized, Asymmetrical Single Chip Packages for 100 V GaN HEMTs

1Ultra-High Throughput E/W-Band Downlink CubeSat Mission

1The EIVE CubeSat : Developing a Satellite Bus for a 71-76 GHz E-Band Transmitter Payload

2Online Health Monitoring in Power Modules for Inverter Topologies using Isolated Parameter Acquisition

3Compact Half-Bridge Module for a Charger Application Utilizing GaN Power Devices with Integrated Driver

2Dynamic Thermal Design of an Active Power Cycling Test Bench for SiC MOSFETs

3High thermal conductance AlN power module with hybrid integrated gate drivers and SiC trench MOSFETs for 2 kW single-phase PV inverter

3Device performance tuning of Ge gate-all-around tunneling field effect transistors by means of GeSn: Potential and challenges

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