Ž. Božić, and S. Schmauder. Special Issue of the International Conference on Structural Integrity and Durability, 89, 5, page 789. Berlin, Springer, (2019)
E. Deryugin, N. Narkevich, I. Danilenko, and S. Schmauder. International Conference on Modern Trends in Manufacturing Technologies and Equipment (ICMTMTE) 2020, 971, page 022082. IOP Publishing, (2020)
E. Deryugin, N. Narkevich, G. Lasko, I. Danilenko, and S. Schmauder. Proceedings of the International Conference on Physical Mesomechanics : Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology, 2310, 1, page 020073. American Institute of Physics, (2020)
E. Deryugin, N. Narkevich, G. Lasko, I. Danilenko, and S. Schmauder. Proceedings of the International Conference on Physical Mesomechanics : Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology, 2310, 1, page 020074. American Institute of Physics, (2020)
P. Gauder, X. Schuler, and M. Seidenfuss. ASME 2018 Pressure Vessels and Piping Conference, 1A : Codes and Standards, page PVP2018-84155, V01AT01A044. The American Society of Mechanical Engineers, (2019)
V. Guski, A. Krebs, U. Weber, and S. Schmauder. Solid oxide fuel cells 14 (SOFC-XIV), volume 3 of ECS transactions, page 1765-1777. Pennington, NJ, The Electrochemical Society, (2015)
S. Hocker, M. Hummel, P. Binkele, H. Lipp, and S. Schmauder. Articles from EUROMECH Colloquium 577 "Micromechanics of Metal Ceramic Composites", 116, page 32-43. Amsterdam, Elsevier, (2016)
M. Hummel, C. Böhm, W. Verestek, and S. Schmauder. Proceedings of the 28th International Workshop on Computational Mechanics of Materials (IWCMM28), 166, page 150-154. Amsterdam, Elsevier, (2019)
M. Hummel, A. Prskalo, P. Binkele, and S. Schmauder. High performance computing in science and engineering '14 : transactions of the High Performance Computing Center, Stuttgart (HLRS) 2014, Springer, Cham, (2015)
A. Jüngert, M. Friedrich, M. Huang, A. Klenk, and S. Weihe. Proceedings of the ASME Pressure Vessels and Piping Conference - 2018, 5 : High-pressure technology; non-destructive evaluation, diagnosis and prognosis; Student Paper Symposium and Competition, page V005T09A010. New York, N.Y., The American Society of Mechanical Engineers, (2019)
A. Jüngert, O. Jacobs, P. Gauder, and S. Weihe. Proceedings of ASME 2021 Pressure Vessels and Piping Conference (PVP2021), 5 : Operations, Applications, and Components - Seismic Engineering - Non-Destructive Examination, page V005T09A003. Red Hook, Curran Associates, Inc., (2021)
M. Kuczynska, U. Becker, Y. Maniar, and S. Weihe. Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021), page V001T06A004. New York, NY, USA, the American Society of Mechanical Engineers, (2021)
M. Kuczynska, Y. Maniar, N. Schafet, U. Becker, and S. Weihe. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Piscataway, NJ, IEEE, (2019)
S. Küster, U. Weber, and S. Schmauder. 7th International Symposium on Defect and Material Mechanics : book of abstracts, page 42-43. Bremen, University of Bremen, (2015)