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Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading

, , , , and . 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Piscataway, NJ, IEEE, (2019)

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Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading, , , , and . 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Piscataway, NJ, IEEE, (2019)