Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading
M. Kuczynska, U. Becker, Y. Maniar, and S. Weihe. Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021), page V001T06A004. New York, NY, USA, the American Society of Mechanical Engineers, (2021)
DOI: 10.1115/IPACK2021-73319
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
year
2021
pages
V001T06A004
publisher
the American Society of Mechanical Engineers
venue
Online
isbn
978-0-7918-8550-5
affiliations
Bosch; Bosch; University of Stuttgart
language
eng
eventdate
2021-10-26/2021-10-28
eventtitle
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
affiliation
Kuczynska, M (Corresponding Author), Robert Bosch GmbH, Automot Elect Div, Postfach 300240, D-70442 Stuttgart, Germany.
Kuczynska, Marta; Becker, Ulrich, Robert Bosch GmbH, Automot Elect Div, Postfach 300240, D-70442 Stuttgart, Germany.
Maniar, Youssef, Robert Bosch GmbH, Corp Res Div, Postfach 300240, D-70442 Stuttgart, Germany.
Weihe, Stefan, Univ Stuttgart, Mat Testing Inst MPA, Pfaffenwaldring 32, D-70569 Stuttgart, Germany.
%0 Conference Paper
%1 kuczynska2021numerical
%A Kuczynska, Marta
%A Becker, Ulrich
%A Maniar, Youssef
%A Weihe, Stefan
%B Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
%C New York, NY, USA
%D 2021
%I the American Society of Mechanical Engineers
%K ubs_10004 ubs_20004 ubs_30047 ubs_40074 unibibliografie wos
%P V001T06A004
%R 10.1115/IPACK2021-73319
%T Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading
%@ 978-0-7918-8550-5
@inproceedings{kuczynska2021numerical,
added-at = {2023-04-06T12:43:34.000+0200},
address = {New York, NY, USA},
affiliation = {Kuczynska, M (Corresponding Author), Robert Bosch GmbH, Automot Elect Div, Postfach 300240, D-70442 Stuttgart, Germany.
Kuczynska, Marta; Becker, Ulrich, Robert Bosch GmbH, Automot Elect Div, Postfach 300240, D-70442 Stuttgart, Germany.
Maniar, Youssef, Robert Bosch GmbH, Corp Res Div, Postfach 300240, D-70442 Stuttgart, Germany.
Weihe, Stefan, Univ Stuttgart, Mat Testing Inst MPA, Pfaffenwaldring 32, D-70569 Stuttgart, Germany.},
affiliations = {Bosch; Bosch; University of Stuttgart},
author = {Kuczynska, Marta and Becker, Ulrich and Maniar, Youssef and Weihe, Stefan},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/249a156418d6e1c7ca5ddfaf49e6b3bba/unibiblio},
booktitle = {Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)},
doi = {10.1115/IPACK2021-73319},
eventdate = {2021-10-26/2021-10-28},
eventtitle = {ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)},
interhash = {28fed5aed6b0dbaa43a5e398bdc305b8},
intrahash = {49a156418d6e1c7ca5ddfaf49e6b3bba},
isbn = {978-0-7918-8550-5},
keywords = {ubs_10004 ubs_20004 ubs_30047 ubs_40074 unibibliografie wos},
language = {eng},
pages = {V001T06A004},
publisher = {the American Society of Mechanical Engineers},
timestamp = {2023-04-06T12:43:34.000+0200},
title = {Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading},
unique-id = {WOS:000884335000045},
venue = {Online},
year = 2021
}
