Y. Maniar, A. Kabakchiev, M. Kuczynska, M. Bazrafshan, P. Binkele, and S. Schmauder. Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021), page V001T06A003. New York, NY, USA, the American Society of Mechanical Engineers, (2021)
M. Hummel, C. Böhm, W. Verestek, and S. Schmauder. Proceedings of the 28th International Workshop on Computational Mechanics of Materials (IWCMM28), 166, page 150-154. Amsterdam, Elsevier, (2019)