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Nonlocal Damage Modeling of Solder Joint Failure under Thermal and Thermomechanical cyclic Loading

, , , , , and . Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021), page V001T06A003. New York, NY, USA, the American Society of Mechanical Engineers, (2021)
DOI: 10.1115/IPACK2021-73100

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