%0 Conference Paper %1 maniar2021nonlocal %A Maniar, Youssef %A Kabakchiev, Alexander %A Kuczynska, Marta %A Bazrafshan, Masoomeh %A Binkele, Peter %A Schmauder, Siegfried %B Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) %C New York, NY, USA %D 2021 %I the American Society of Mechanical Engineers %K ubs_10004 ubs_20004 ubs_30047 ubs_40073 ubs_40074 unibibliografie wos %P V001T06A003 %R 10.1115/IPACK2021-73100 %T Nonlocal Damage Modeling of Solder Joint Failure under Thermal and Thermomechanical cyclic Loading %@ 978-0-7918-8550-5

@inproceedings{maniar2021nonlocal, added-at = {2023-04-06T12:43:34.000+0200}, address = {New York, NY, USA}, affiliation = {Maniar, Y (Corresponding Author), Robert Bosch GmbH, Corp Sect Res & Adv Engn, D-71272 Renningen, Germany. Maniar, Youssef; Kabakchiev, Alexander, Robert Bosch GmbH, Corp Sect Res & Adv Engn, D-71272 Renningen, Germany. Kuczynska, Marta; Bazrafshan, Masoomeh, Robert Bosch GmbH, Automot Elect, D-71701 Schwieberdingen, Germany. Binkele, Peter; Schmauder, Siegfried, Univ Stuttgart, Inst Mat Testing Mat Sci & Strength Mat IMWF, D-70569 Stuttgart, Germany.}, affiliations = {Bosch; Bosch; University of Stuttgart}, author = {Maniar, Youssef and Kabakchiev, Alexander and Kuczynska, Marta and Bazrafshan, Masoomeh and Binkele, Peter and Schmauder, Siegfried}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2fbfaa93b85f5aa343865a866abfb7b6a/unibiblio}, booktitle = {Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)}, doi = {10.1115/IPACK2021-73100}, eventdate = {2021-10-26/2021-10-28}, eventtitle = {ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)}, interhash = {5681557a1c41057eb9ae10d3b3dc7ca1}, intrahash = {fbfaa93b85f5aa343865a866abfb7b6a}, isbn = {978-0-7918-8550-5}, keywords = {ubs_10004 ubs_20004 ubs_30047 ubs_40073 ubs_40074 unibibliografie wos}, language = {eng}, pages = {V001T06A003}, publisher = {the American Society of Mechanical Engineers}, timestamp = {2023-04-06T12:43:34.000+0200}, title = {Nonlocal Damage Modeling of Solder Joint Failure under Thermal and Thermomechanical cyclic Loading}, unique-id = {WOS:000884335000044}, venue = {Online}, year = 2021 }