Y. Maniar, A. Kabakchiev, M. Kuczynska, M. Bazrafshan, P. Binkele, und S. Schmauder. Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021), Seite V001T06A003. New York, NY, USA, the American Society of Mechanical Engineers, (2021)
E. Deryugin, N. Narkevich, G. Lasko, I. Danilenko, und S. Schmauder. Proceedings of the International Conference on Physical Mesomechanics : Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology, 2310, 1, Seite 020073. American Institute of Physics, (2020)
E. Deryugin, N. Narkevich, G. Lasko, I. Danilenko, und S. Schmauder. Proceedings of the International Conference on Physical Mesomechanics : Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology, 2310, 1, Seite 020074. American Institute of Physics, (2020)
I. Schäfer, und S. Schmauder. 7th GACM Colloquium on Computational Mechanics for Young Scientists from Academia and Industry, Seite 246-247. Stuttgart, Institute for Structural Mechanics, (2017)
M. Mlikota, und S. Schmauder. Advances in Engineering Materials, Structures and Systems : Innovations, Mechanics and Applications, Seite 587-592. Boca Raton, CRC Press, Taylor & Francis Group, (2019)
Ž. Božić, und S. Schmauder. Special Issue of the International Conference on Structural Integrity and Durability, 89, 5, Seite 789. Berlin, Springer, (2019)
M. Hummel, A. Prskalo, P. Binkele, und S. Schmauder. High performance computing in science and engineering '14 : transactions of the High Performance Computing Center, Stuttgart (HLRS) 2014, Springer, Cham, (2015)
M. Hummel, C. Böhm, W. Verestek, und S. Schmauder. Proceedings of the 28th International Workshop on Computational Mechanics of Materials (IWCMM28), 166, Seite 150-154. Amsterdam, Elsevier, (2019)
Z. Zhang, Z. Hu, H. Tu, S. Schmauder, und G. Wu. Materials science & engineering. A, Structural materials: properties, microstructure and processing, (2017)