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Hot-Carrier Reliability for Si and SiGe HBTs: Aging Procedure, Extrapolation Model Limitations and Applications., and . Microelectronics Reliability, 41 (9-10): 1307-1312 (2001)Process dependence of BTI reliability in advanced HK MG stacks., , , , , , , and . Microelectronics Reliability, 49 (9-11): 982-988 (2009)CMOS VT characterization by capacitance measurements in FDSOI PIN gated diodes., , , , , and . ESSDERC, page 405-408. IEEE, (2014)Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices., , , , , , , , , and 5 other author(s). ESSDERC, page 144-147. IEEE, (2017)Impact of Passive & Active Load Gate Impedance on Breakdown Hardness in 28nm FDSOI Technology., , , , , , and . IRPS, page 1-5. IEEE, (2019)Performance & reliability of 3D architectures (πfet, Finfet, Ωfet)., , , , , , , , , and . IRPS, page 6. IEEE, (2018)Performance and reliability of strained SOI transistors for advanced planar FDSOI technology., , , , , , , , , and . IRPS, page 2. IEEE, (2015)Noise-induced dynamic variability in nano-scale CMOS SRAM cells., , , , and . ESSDERC, page 256-259. IEEE, (2016)AC TDDB extensive study for an enlargement of its impact and benefit on circuit lifetime assessment., , , , , and . IRPS, page 4. IEEE, (2018)A novel insight of pBTI degradation in GaN-on-Si E-mode MOSc-HEMT., , , , , , , , and . IRPS, page 4. IEEE, (2018)