M. Benke, J. Zhang, M. Kübler, J. Anders, and J. Wrachtrup. 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), page 273-275. Piscataway, NJ, IEEE, (2024)
H. Bürkle, T. Klotz, R. Krapf, and J. Anders. ESSCIRC 2021 : IEEE 47th European Solid State Circuits Conference (ESSCIRC), page 327-330. Piscataway, IEEE, (2021)