H. Bürkle, T. Klotz, R. Krapf, and J. Anders. ESSCIRC 2021 : IEEE 47th European Solid State Circuits Conference (ESSCIRC), page 327-330. Piscataway, IEEE, (2021)
T. Munz, N. Schäfer, T. Blascheck, K. Kurzhals, E. Zhang, and D. Weiskopf. VINCI '20: Proceedings of the 13th International Symposium on Visual Information Communication and Interaction, page 11. Association for Computing Machinery, (2020)