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Disambiguation of "Tokei, Zsolt"

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As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.

, , , , , , , , , , and . Microelectronics Reliability, 54 (9-10): 1675-1679 (2014)

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Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line., , , , , and . Microelectronics Reliability, (2016)Reliability challenges for copper low-k dielectrics and copper diffusion barriers., , and . Microelectronics Reliability, 45 (9-11): 1436-1442 (2005)Stress mitigation of 3D-stacking/packaging induced stresses., , , , , , , , and . IRPS, page 4. IEEE, (2018)As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability., , , , , , , , , and 1 other author(s). Microelectronics Reliability, 54 (9-10): 1675-1679 (2014)Insights into metal drift induced failure in MOL and BEOL., , , , , , and . IRPS, page 3. IEEE, (2018)Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies., , , , , , , , , and 6 other author(s). ESSDERC, page 102-105. IEEE, (2014)Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability., , , , and . Microelectronics Reliability, 45 (9-11): 1299-1304 (2005)Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling., , , , , , , , , and 2 other author(s). Microelectronics Reliability, 54 (6-7): 1200-1205 (2014)The first observation of p-type electromigration failure in full ruthenium interconnects., , , , , , , and . IRPS, page 6. IEEE, (2018)A tool flow for predicting system level timing failures due to interconnect reliability degradation., , , , , and . ACM Great Lakes Symposium on VLSI, page 291-296. ACM, (2008)