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Disambiguation of "Gonzalez, Mario"

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Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

, , , , , and . Microelectronics Reliability, (2016)

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Mario Rosenfelder University of Stuttgart

Cooperative object transportation with differential-drive mobile robots : Control and experimentation, , and . Robotics and autonomous systems, 173 (March): 104612 (2024)

Mario Fuksa University of Stuttgart

Mario Heene

Mario Döbler University of Stuttgart

Mario Gaimann University of Stuttgart

 

Other publications of authors with the same name

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line., , , , , and . Microelectronics Reliability, (2016)Metallization scheme optimization of plastic-encapsulated electronic power devices., , , and . ICICDT, page 1-4. IEEE, (2015)Joint denoising and decompression using CNN regularization., , , and . CVPR Workshops, page 2598-2601. IEEE Computer Society, (2018)Increase attractor capacity using an ensembled neural network., , , and . Expert Syst. Appl., (2017)Modular multilevel converter for large-scale photovoltaic generation with reactive power flow and unbalanced active power extraction capabilities., , , and . Mathematics and Computers in Simulation, (2019)Modeling Sustainability Reporting with Ternary Attractor Neural Networks., , , , and . MIKE, volume 11308 of Lecture Notes in Computer Science, page 259-267. Springer, (2018)Modeling sustainability report scoring sequences using an attractor network., , , and . Neurocomputing, (2015)Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly., , , and . Microelectronics Reliability, (2018)Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability., , , , , , , and . Microelectronics Reliability, 55 (1): 143-154 (2015)Design and implementation of flexible and stretchable systems., , , , , , , , and . Microelectronics Reliability, 51 (6): 1069-1076 (2011)