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Disambiguation of "Beyne, Eric"

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Stress mitigation of 3D-stacking/packaging induced stresses.

, , , , , , , , and . IRPS, page 4. IEEE, (2018)

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Eric Steinbrücker University of Stuttgart

Dr. -Ing. Eric Jennes University of Stuttgart

Eric Nkrumah University of Stuttgart

Eric Price University of Stuttgart

Dr. rer. nat. Eric Heintze University of Stuttgart

 

Other publications of authors with the same name

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding., , , , , , , , , and 6 other author(s). 3DIC, page 1-4. IEEE, (2011)Cost effectiveness of 3D integration options., , and . 3DIC, page 1-6. IEEE, (2010)Direct gold and copper wires bonding on copper., , , , , and . Microelectronics Reliability, 43 (6): 913-923 (2003)TSV process-induced MOS reliability degradation., , , , , , and . IRPS, page 5. IEEE, (2018)Stress mitigation of 3D-stacking/packaging induced stresses., , , , , , , , and . IRPS, page 4. IEEE, (2018)Wafer-level package interconnect options., , , , , , and . IEEE Trans. VLSI Syst., 14 (6): 654-659 (2006)Reliability Challenges Related to TSV Integration and 3-D Stacking., , , , , , , , and . IEEE Design & Test, 33 (3): 37-45 (2016)Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly., , , and . Microelectronics Reliability, (2018)Package level interconnect options., , , , , , and . SLIP, page 21-27. ACM, (2005)Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges., , , , , , , and . 3DIC, page 1-7. IEEE, (2014)