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As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.

B. Tang, K. Croes, Y. Barbarin, Y. Wang, R. Degraeve, Y. Li, M. Toledano-Luque, T. Kauerauf, J. Bömmels, Z. Tokei, and I. Wolf. Microelectronics Reliability, 54 (9-10): 1675-1679 (2014)

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apl. Prof. Dr. Jürgen Pleiss University of Stuttgart

Univ. -Prof. Dr. Jürgen Pafel University of Stuttgart

Dr. rer. nat. Jürgen Steinwandel University of Stuttgart

Hon. -Prof. Dr. Jürgen Hammer University of Stuttgart

Hon. -Prof. Dr. Jürgen Blum University of Stuttgart

Other publications of authors with the same name

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.L. Kljucar, M. Gonzalez, I. Wolf, K. Croes, J. Bömmels, and Z. Tokei. Microelectronics Reliability, (2016)Constant voltage electromigration for advanced BEOL copper interconnects.B. Tang, K. Croes, N. Jourdan, J. Bömmels, Z. Tokei, I. Wolf, E. Wilcox, and T. McMullen. IRPS, page 2. IEEE, (2015)Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.H. Zahedmanesh, M. Gonzalez, I. Ciofi, K. Croes, J. Bömmels, and Z. Tokei. Microelectronics Reliability, (2016)As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.B. Tang, K. Croes, Y. Barbarin, Y. Wang, R. Degraeve, Y. Li, M. Toledano-Luque, T. Kauerauf, J. Bömmels, Z. Tokei and 1 other author(s). Microelectronics Reliability, 54 (9-10): 1675-1679 (2014)Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies.T. Bao, D. Yakimets, J. Ryckaert, I. Ciofi, R. Baert, A. Veloso, J. Bömmels, N. Collaert, P. Roussel, S. Demuynck and 6 other author(s). ESSDERC, page 102-105. IEEE, (2014)Design Technology co-optimization for N10.J. Ryckaert, P. Raghavan, R. Baert, M. Bardon, M. Dusa, A. Mallik, S. Sakhare, B. Vandewalle, P. Wambacq, B. Chava and 18 other author(s). CICC, page 1-8. IEEE, (2014)Impact of process variability on BEOL TDDB lifetime model assessment.K. Croes, D. Kocaay, I. Ciofi, J. Bömmels, and Z. Tokei. IRPS, page 5. IEEE, (2015)Intrinsic reliability of local interconnects for N7 and beyond.K. Croes, A. Lesniewska, C. Wu, I. Ciofi, A. Banczerowska, B. Briggs, S. Demuynck, Z. Tokei, J. Bömmels, Y. Saad and 1 other author(s). IRPS, page 2. IEEE, (2015)

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As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.

Please choose a person to relate this publication to

apl. Prof. Dr. Jürgen Pleiss University of Stuttgart

Univ. -Prof. Dr. Jürgen Pafel University of Stuttgart

Dr. rer. nat. Jürgen Steinwandel University of Stuttgart

Hon. -Prof. Dr. Jürgen Hammer University of Stuttgart

Hon. -Prof. Dr. Jürgen Blum University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Bömmels, Jürgen"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.

Please choose a person to relate this publication to

apl. Prof. Dr. Jürgen Pleiss University of Stuttgart

Univ. -Prof. Dr. Jürgen Pafel University of Stuttgart

Dr. rer. nat. Jürgen Steinwandel University of Stuttgart

Hon. -Prof. Dr. Jürgen Hammer University of Stuttgart

Hon. -Prof. Dr. Jürgen Blum University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
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DOI
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As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.