Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Irie, Naohiko
add a person with the name Irie, Naohiko
 

Other publications of authors with the same name

Embedded SoC Resource Manager to Control Temperature and Data Bandwidth., , , , , , , , , and 3 other author(s). ISSCC, page 296-604. IEEE, (2007)3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link., , , , , , , , , and 3 other author(s). J. Solid-State Circuits, 45 (4): 856-862 (2010)A Hardware Accelerator for JavaTM Platforms on a 130-nm Embedded Processor Core., , , , , , , and . IEICE Transactions, 90-C (2): 523-530 (2007)An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM., , , , , , , , , and 3 other author(s). ISSCC, page 480-481. IEEE, (2009)Hierarchical power distribution and power management scheme for a single chip mobile processor., , , , , , , , , and 23 other author(s). DAC, page 292-295. ACM, (2006)Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration., , , , , , and . IEEE Trans. VLSI Syst., 19 (10): 1902-1907 (2011)A 4320MIPS Four-Processor Core SMP/AMP with Individually Managed Clock Frequency for Low Power Consumption., , , , , , , , , and 4 other author(s). ISSCC, page 100-590. IEEE, (2007)Elastic shared resource scheduling SOC interconnect architecture for real-time system., , , , , , , , , and 1 other author(s). CICC, page 787-790. IEEE, (2005)Modeling and Experimental Verification of Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for Low-Power 3-D System Integration., , , , , , , and . IEEE Trans. VLSI Syst., 18 (8): 1238-1243 (2010)Multi-Core/Multi-IP Technology for Embedded Applications., and . IEICE Transactions, 92-C (10): 1232-1239 (2009)