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Mechanism of O2-anneal induced Vfb shifts of Ru gated stacks., , , , , , , , , and 5 other author(s). Microelectronics Reliability, 47 (4-5): 518-520 (2007)Potential remedies for the VT/Vfb-shift problem of Hf/polysilicon-based gate stacks: a solution-based survey., , , , , , , , , and . Microelectronics Reliability, 45 (5-6): 786-789 (2005)Towards high performance sub-10nm finW bulk FinFET technology., , , , , , , , , and 10 other author(s). ESSDERC, page 131-134. IEEE, (2016)WS2 transistors on 300 mm wafers with BEOL compatibility., , , , , , , , , and 8 other author(s). ESSDERC, page 212-215. IEEE, (2017)Reliability impact of advanced doping techniques for DRAM peripheral MOSFETs., , , , , , , and . ICICDT, page 1-4. IEEE, (2015)Performance improvement of self-aligned HfO2/TaN and SiON/TaN nMOS transistors., , , , , , , , , and . Microelectronics Reliability, 45 (5-6): 779-782 (2005)I/O thick oxide device integration using Diffusion and Gate Replacement (D&GR) gate stack integration., , , , , , , , , and 2 other author(s). ICICDT, page 1-4. IEEE, (2015)Impact of Off State Stress on advanced high-K metal gate NMOSFETs., , , , , , and . ESSDERC, page 365-368. IEEE, (2014)Off-state stress degradation mechanism on advanced p-MOSFETs., , , , , , , , and . ICICDT, page 1-4. IEEE, (2015)Assessment of SiGe quantum well transistors for DRAM peripheral applications., , , , , , , , , and 1 other author(s). ICICDT, page 1-4. IEEE, (2015)