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Signal integrity modeling and measurement of TSV in 3D IC., and . ASP-DAC, page 13-16. IEEE, (2013)Design of a Low-Noise UWB Transceiver SiP., , , , , , and . IEEE Design & Test of Computers, 25 (1): 18-28 (2008)Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material., , , , , , , , and . IEEE Trans. Industrial Electronics, 66 (5): 4054-4064 (2019)TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC., , , , , , and . EMC Compo, page 212-215. IEEE, (2015)Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC., , , , , , , , , and 1 other author(s). 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array., , , , , and . IEEE Design & Test of Computers, 23 (3): 212-219 (2006)Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs., , , , , , and . 3DIC, page 1-6. IEEE, (2014)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling., , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)Eye-diagram simulation and analysis of a high-speed TSV-based channel., , , , , , , and . 3DIC, page 1-7. IEEE, (2013)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling., , , , , , , , and . EMC Compo, page 158-162. IEEE, (2013)