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Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).

D. Kim, K. Athikulwongse, M. Healy, M. Hossain, M. Jung, I. Khorosh, G. Kumar, Y. Lee, D. Lewis, T. Lin, C. Liu, S. Panth, M. Pathak, M. Ren, G. Shen, T. Song, D. Woo, X. Zhao, J. Kim, H. Choi, G. Loh, H. Lee, and S. Lim. IEEE Trans. Computers, 64 (1): 112-125 (2015)

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Qian Song University of Stuttgart

Electrocatalytic proton reduction: Metal based fused diporphyrins with proton relays for efficient catalysisA. Singha Hazari, S. Chandra, Q. Song, D. Hunger, N. Neuman, J. Slageren, E. Klemm, B. Sarkar, and S. Kar. Dataset, (2024)Related to: Chandra, S., Singha Hazari, A., Song, Q., Hunger, D., Neuman, N. I., van Slageren, J., Klemm, E. & Sarkar, B. (2023). Remarkable Enhancement of Catalytic Activity of Cu-Complexes in the Electrochemical Hydrogen Evolution Reaction by Using Triply Fused Porphyrin. ChemSusChem 16, e202201146. doi: 10.1002/cssc.202201146.

Jianing Song University of Stuttgart

Bowen Song University of Stuttgart

Jing Song University of Stuttgart

Other publications of authors with the same name

Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs.Y. Peng, T. Song, D. Petranovic, and S. Lim. ICCAD, page 649-655. IEEE, (2015)Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).D. Kim, K. Athikulwongse, M. Healy, M. Hossain, M. Jung, I. Khorosh, G. Kumar, Y. Lee, D. Lewis, T. Lin and 13 other author(s). IEEE Trans. Computers, 64 (1): 112-125 (2015)Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling.Y. Peng, T. Song, D. Petranovic, and S. Lim. IEEE Trans. on CAD of Integrated Circuits and Systems, 33 (12): 1900-1913 (2014)3D-MAPS: 3D Massively parallel processor with stacked memory.D. Kim, K. Athikulwongse, M. Healy, M. Hossain, M. Jung, I. Khorosh, G. Kumar, Y. Lee, D. Lewis, T. Lin and 13 other author(s). ISSCC, page 188-190. IEEE, (2012)How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core.M. Jung, T. Song, Y. Wan, Y. Lee, D. Mohapatra, H. Wang, G. Taylor, D. Jariwala, V. Pitchumani, P. Morrow and 3 other author(s). CICC, page 1-4. IEEE, (2013)Signal integrity analysis and optimization for 3D ICs.C. Liu, T. Song, and S. Lim. ISQED, page 42-49. IEEE, (2011)Die-to-Die Parasitic Extraction Targeting Face-to-Face Bonded 3D ICs.T. Song, and S. Lim. J. Inform. and Commun. Convergence Engineering, (2015)More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs.T. Song, S. Panth, Y. Chae, and S. Lim. IEEE Trans. on CAD of Integrated Circuits and Systems, 35 (12): 2056-2067 (2016)Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.T. Song, C. Liu, D. Kim, S. Lim, J. Cho, J. Kim, J. Pak, S. Ahn, J. Kim, and K. Yoon. ISQED, page 122-128. IEEE, (2011)Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs.T. Song, C. Liu, Y. Peng, and S. Lim. IEEE Trans. VLSI Syst., 24 (5): 1636-1648 (2016)

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Disambiguation of "Song, Taigon"

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Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).

Please choose a person to relate this publication to

Qian Song University of Stuttgart

Jianing Song University of Stuttgart

Bowen Song University of Stuttgart

Jing Song University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Song, Taigon"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).

Please choose a person to relate this publication to

Qian Song University of Stuttgart

Jianing Song University of Stuttgart

Bowen Song University of Stuttgart

Jing Song University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).