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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. EMC Compo, page 158-162. IEEE, (2013)

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Sumee Park

Soo Yong Park University of Stuttgart

Other publications of authors with the same name

An adaptive peer-to-peer live streaming system with incentives for resilience.K. Park, S. Pack, and T. Kwon. Computer Networks, 54 (8): 1316-1327 (2010)SCAN: Scalable Content Routing for Content-Aware Networking.M. Lee, K. Cho, K. Park, T. Kwon, and Y. Choi. ICC, page 1-5. IEEE, (2011)Mining the Minds of Customers from Online Chat Logs.K. Park, J. Kim, J. Park, M. Cha, J. Nam, S. Yoon, and E. Rhim. CIKM, page 1879-1882. ACM, (2015)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. 3DIC, page 1-4. IEEE, (2013)Eye-diagram simulation and analysis of a high-speed TSV-based channel.H. Kim, J. Cho, J. Kim, D. Jung, S. Choi, J. Kim, J. Lee, and K. Park. 3DIC, page 1-7. IEEE, (2013)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. EMC Compo, page 158-162. IEEE, (2013)Proximity Based Peer-to-Peer Overlay Networks (P3ON) with Load Distribution.K. Park, S. Pack, and T. Kwon. ICOIN, volume 5200 of Lecture Notes in Computer Science, page 234-243. Springer, (2007)SAMP: scalable application-layer mobility protocol.S. Pack, K. Park, T. Kwon, and Y. Choi. IEEE Communications Magazine, 44 (6): 86-92 (2006)Proxy-Based Wireless Data Access Algorithms in Mobile Hotspots.S. Pack, H. Rutagemwa, X. Shen, J. Mark, and K. Park. IEEE Trans. Vehicular Technology, 57 (5): 3165-3177 (2008)Gender swapping and user behaviors in online social games.J. Lou, K. Park, M. Cha, J. Park, C. Lei, and K. Chen. WWW, page 827-836. International World Wide Web Conferences Steering Committee / ACM, (2013)

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Disambiguation of "Park, Kunwoo"

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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

Please choose a person to relate this publication to

Sumee Park

Soo Yong Park University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Park, Kunwoo"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

Please choose a person to relate this publication to

Sumee Park

Soo Yong Park University of Stuttgart

Other publications of authors with the same name

Disambiguation

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URL
DOI
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APA
Chicago
DIN 1505
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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.