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Disambiguation of "Kim, Heegon"

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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

, , , , , , , , and . EMC Compo, page 158-162. IEEE, (2013)

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Kim Meliani University of Stuttgart

Joel Kimmich University of Stuttgart

Do Yeon Kim University of Stuttgart

Dr. Wolfgang Kimmerle University of Stuttgart

Dr. -Ing. Kim Riedmüller University of Stuttgart

 

Other publications of authors with the same name

Fault detection and isolation of multiple defects in through silicon via (TSV) channel., , , , , , and . 3DIC, page 1-5. IEEE, (2014)Depth-Based Detection of Standing-Pigs in Moving Noise Environments., , , , , , , and . Sensors, 17 (12): 2757 (2017)CPU-GPU hybrid computing for feature extraction from video stream., , , , and . IEICE Electronic Express, 11 (22): 20140932 (2014)Power-Time Tradeoff of Parallel Execution on Multi-core Platforms., , and . MUSIC, volume 274 of Lecture Notes in Electrical Engineering, page 157-163. Springer, (2013)TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC., , , , , , and . EMC Compo, page 212-215. IEEE, (2015)Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module., , , , , and . 3DIC, page TS2.2.1-TS2.2.4. IEEE, (2015)Modeling and analysis of open defect in through silicon via (TSV) channel., , , , , and . EMC Compo, page 163-166. IEEE, (2013)Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling., , , , , , , and . EMC Compo, page 5-9. IEEE, (2013)Machine Learning based Link State Aware Service Function Chaining., , , and . APNOMS, page 1-4. IEEE, (2019)Analysis and optimization of a power distribution network in 2.5D IC with glass interposer., , , , , , , and . 3DIC, page 1-4. IEEE, (2014)