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Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. 3DIC, page 1-4. IEEE, (2013)

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H. Binz

Mathias Jung University of Stuttgart

H. Bungartz

Philipp Junger

H. Binz

Other publications of authors with the same name

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.J. Kim, B. Bae, S. Kim, S. Kong, H. Kim, D. Jung, and J. Kim. 3DIC, page 1-6. IEEE, (2014)Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.S. Choi, H. Kim, D. Jung, J. Kim, J. Lim, H. Lee, K. Cho, J. Kim, H. Kim, Y. Kim and 1 other author(s). 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. EMC Compo, page 158-162. IEEE, (2013)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. 3DIC, page 1-4. IEEE, (2013)Eye-diagram simulation and analysis of a high-speed TSV-based channel.H. Kim, J. Cho, J. Kim, D. Jung, S. Choi, J. Kim, J. Lee, and K. Park. 3DIC, page 1-7. IEEE, (2013)Fault detection and isolation of multiple defects in through silicon via (TSV) channel.D. Jung, H. Kim, J. Kim, S. Kim, J. Kim, H. Bae, and K. Choi. 3DIC, page 1-5. IEEE, (2014)Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.J. Lim, M. Lee, D. Jung, J. Kim, S. Choi, H. Lee, and J. Kim. EMC Compo, page 248-251. IEEE, (2015)TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.J. Kim, D. Jung, H. Kim, S. Kong, S. Choi, J. Lim, and J. Kim. EMC Compo, page 212-215. IEEE, (2015)Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.D. Jung, H. Kim, J. Kim, S. Kim, J. Kim, H. Bae, and K. Choi. 3DIC, page TS8.29.1-TS8.29.4. IEEE, (2015)High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.M. Lee, D. Jung, H. Kim, J. Cho, and J. Kim. IEEE Design & Test, 33 (2): 17-29 (2016)

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Disambiguation of "Jung, Daniel H."

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Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

Please choose a person to relate this publication to

H. Binz

Mathias Jung University of Stuttgart

H. Bungartz

Philipp Junger

H. Binz

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Jung, Daniel H."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

Please choose a person to relate this publication to

H. Binz

Mathias Jung University of Stuttgart

H. Bungartz

Philipp Junger

H. Binz

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.