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Disambiguation of "Jung, Daniel H."

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Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

, , , , , , and . 3DIC, page 1-6. IEEE, (2014)

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H. Binz

Mathias Jung University of Stuttgart

H. Bungartz

Philipp Junger

H. Binz

 

Other publications of authors with the same name

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling., , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)Eye-diagram simulation and analysis of a high-speed TSV-based channel., , , , , , , and . 3DIC, page 1-7. IEEE, (2013)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling., , , , , , , , and . EMC Compo, page 158-162. IEEE, (2013)Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs., , , , , , and . 3DIC, page 1-6. IEEE, (2014)Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC., , , , , , , , , and 1 other author(s). 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)Fault detection and isolation of multiple defects in through silicon via (TSV) channel., , , , , , and . 3DIC, page 1-5. IEEE, (2014)Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC., , , , , , and . EMC Compo, page 248-251. IEEE, (2015)TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC., , , , , , and . EMC Compo, page 212-215. IEEE, (2015)High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs., , , , and . IEEE Design & Test, 33 (2): 17-29 (2016)Fault isolation of short defect in through silicon via (TSV) based 3D-IC., , , , , , , and . 3DIC, page 1-4. IEEE, (2013)