Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Conference Paper
%1 conf/3dic/KimKKBJKKLP13
%A Kim, Jonghoon J.
%A Kim, Heegon
%A Kim, Sukjin
%A Bae, Bumhee
%A Jung, Daniel H.
%A Kong, Sunkyu
%A Kim, Joungho
%A Lee, Junho
%A Park, Kunwoo
%B 3DIC
%D 2013
%I IEEE
%K dblp
%P 1-4
%T Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#KimKKBJKKLP13
%@ 978-1-4673-6484-3
@inproceedings{conf/3dic/KimKKBJKKLP13,
added-at = {2017-05-21T00:00:00.000+0200},
author = {Kim, Jonghoon J. and Kim, Heegon and Kim, Sukjin and Bae, Bumhee and Jung, Daniel H. and Kong, Sunkyu and Kim, Joungho and Lee, Junho and Park, Kunwoo},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/24cc912a7ac48d98a53839d50a719b051/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2013},
ee = {https://doi.org/10.1109/3DIC.2013.6702328},
interhash = {2ee3c42639ebf7fbb7a2b749a80c55a1},
intrahash = {4cc912a7ac48d98a53839d50a719b051},
isbn = {978-1-4673-6484-3},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2019-09-27T13:40:43.000+0200},
title = {Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#KimKKBJKKLP13},
year = 2013
}