Author of the publication

thermo-mechanical behavior of a 3D stack - Challenges and solutions.

G. der Plas, S. Thijs, D. Linten, G. Katti, P. Limaye, A. Mercha, M. Stucchi, H. Oprins, B. Vandevelde, N. Minas, M. Cupac, M. Dehan, M. Nelis, R. Agarwal, W. Dehaene, Y. Travaly, E. Beyne, and P. Marchal. CICC, page 1-4. IEEE, (2010)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Mercha, Abdelkarim

add a person with the name Mercha, Abdelkarim

Other publications of authors with the same name

STI and eSiGe source/drain epitaxy induced stress modeling in 28 nm technology with replacement gate (RMG) process.D. Jang, M. Bardon, D. Yakimets, K. Miyaguchi, A. Keersgieter, T. Chiarella, R. Ritzenthaler, M. Dehan, and A. Mercha. ESSDERC, page 159-162. IEEE, (2013)Design technology co-optimization for enabling 5nm gate-all-around nanowire 6T SRAM.T. Bao, S. Sakhare, J. Ryckaert, D. Yakimets, A. Mercha, D. Verkest, A. Thean, and P. Wambacq. ICICDT, page 1-4. IEEE, (2015)Technology and architecture for deep submicron RF CMOS technology.A. Mercha. SBCCI, page 4. ACM, (2005)Impact on the back gate degradation in partially depleted SOI n-MOSFETs by 2-MeV electron irradiation.K. Hayama, K. Takakura, K. Shigaki, H. Ohyama, J. Rafí, A. Mercha, E. Simoen, and C. Claeys. Microelectronics Reliability, 46 (9-11): 1731-1735 (2006)Design Technology co-optimization for N10.J. Ryckaert, P. Raghavan, R. Baert, M. Bardon, M. Dusa, A. Mallik, S. Sakhare, B. Vandewalle, P. Wambacq, B. Chava and 18 other author(s). CICC, page 1-8. IEEE, (2014)Technologies for (sub-) 45nm Analog/RF CMOS - Circuit Design Opportunities and Challenges.S. Decoutere, P. Wambacq, V. Subramanian, J. Borremans, and A. Mercha. CICC, page 679-686. IEEE, (2006)Holisitic device exploration for 7nm node.P. Raghavan, M. Bardon, D. Jang, P. Schuddinck, D. Yakimets, J. Ryckaert, A. Mercha, N. Horiguchi, N. Collaert, A. Mocuta and 5 other author(s). CICC, page 1-5. IEEE, (2015)Analysis of microbump induced stress effects in 3D stacked IC technologies.A. Ivankovic, G. der Plas, V. Moroz, M. Choi, V. Cherman, A. Mercha, P. Marchal, M. Gonzalez, G. Eneman, W. Zhang and 9 other author(s). 3DIC, page 1-5. IEEE, (2011)Degradation of electrical performance and floating body effect in ultra thin gate oxide FD-SOI n-MOSFETs by 7.5-MeV proton irradiation.K. Hayama, K. Takakura, H. Ohyama, A. Mercha, E. Simoen, C. Claeys, J. Rafí, and M. Kokkoris. Microelectronics Reliability, 44 (9-11): 1721-1726 (2004)Identifying the Bottlenecks to the RF Performance of FinFETs.V. Subramanian, A. Mercha, B. Parvais, M. Dehan, G. Groeseneken, W. Sansen, and S. Decoutere. VLSI Design, page 111-116. IEEE Computer Society, (2010)

PUMA

Disambiguation of "Mercha, Abdelkarim"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

Please choose a person to relate this publication to

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Mercha, Abdelkarim"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

Please choose a person to relate this publication to

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.