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Analysis of microbump induced stress effects in 3D stacked IC technologies.

A. Ivankovic, G. der Plas, V. Moroz, M. Choi, V. Cherman, A. Mercha, P. Marchal, M. Gonzalez, G. Eneman, W. Zhang, T. Buisson, M. Detalle, A. Manna, D. Verkest, G. Beyer, E. Beyne, B. Vandevelde, I. Wolf, and D. Vandepitte. 3DIC, page 1-5. IEEE, (2011)

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Dr. Vladimir Knjasev University of Stuttgart

Dr. Vladimir Atanasov University of Stuttgart

Vladimir Mikheev University of Stuttgart

Vladimir Yussupov University of Stuttgart

Other publications of authors with the same name

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.W. Guo, G. der Plas, A. Ivankovic, G. Eneman, V. Cherman, B. Wachter, A. Mercha, M. Gonzalez, Y. Civale, A. Redolfi and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). J. Solid-State Circuits, 46 (1): 293-307 (2011)B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages.A. Cowley, A. Ivankovic, C. Wong, N. Bennett, A. Danilewsky, M. Gonzalez, V. Cherman, B. Vandevelde, I. Wolf, and P. McNally. Microelectronics Reliability, (2016)Design issues and considerations for low-cost 3D TSV IC technology.G. der Plas, P. Limaye, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti, D. Velenis and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)Fine grain thermal modeling and experimental validation of 3D-ICs.H. Oprins, A. Srinivasan, M. Cupák, V. Cherman, C. Torregiani, M. Stucchi, G. der Plas, P. Marchal, B. Vandevelde, and E. Cheng. Microelectronics Journal, 42 (4): 572-578 (2011)Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.K. Croes, V. Simons, S. Beyne, V. Cherman, H. Oprins, M. Stucchi, P. Absil, A. Glabman, and E. Wilcox. IRPS, page 1-4. IEEE, (2019)Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing.A. Khaled, M. Raoof, V. Cherman, K. Jans, M. Abbas, S. Ebrahim, G. Bryce, P. Verheyen, A. Witvrouw, and I. Wolf. Microelectronics Reliability, 52 (9-10): 2272-2277 (2012)Analysis of microbump induced stress effects in 3D stacked IC technologies.A. Ivankovic, G. der Plas, V. Moroz, M. Choi, V. Cherman, A. Mercha, P. Marchal, M. Gonzalez, G. Eneman, W. Zhang and 9 other author(s). 3DIC, page 1-5. IEEE, (2011)Thermal experimental and modeling analysis of high power 3D packages.H. Oprins, V. Cherman, G. der Plas, F. Maggioni, J. Vos, and E. Beyne. ICICDT, page 1-4. IEEE, (2015)Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.B. Vandevelde, A. Ivankovic, B. Debecker, M. Lofrano, K. Vanstreels, W. Guo, V. Cherman, M. Gonzalez, G. der Plas, I. Wolf and 2 other author(s). Microelectronics Reliability, 54 (6-7): 1200-1205 (2014)

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Disambiguation of "Cherman, Vladimir"

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Analysis of microbump induced stress effects in 3D stacked IC technologies.

Please choose a person to relate this publication to

Dr. Vladimir Knjasev University of Stuttgart

Dr. Vladimir Atanasov University of Stuttgart

Vladimir Mikheev University of Stuttgart

Vladimir Yussupov University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Cherman, Vladimir"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Analysis of microbump induced stress effects in 3D stacked IC technologies.

Please choose a person to relate this publication to

Dr. Vladimir Knjasev University of Stuttgart

Dr. Vladimir Atanasov University of Stuttgart

Vladimir Mikheev University of Stuttgart

Vladimir Yussupov University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Analysis of microbump induced stress effects in 3D stacked IC technologies.