PUMA

academical publication management
collect, organize, and share publications

( en | de )

 

Disambiguation of "Vandevelde, Bart"

Author of the publication

copydeleteadd this publication to your clipboard
Fine grain thermal modeling and experimental validation of 3D-ICs.

, , , , , , , , , and . Microelectronics Journal, 42 (4): 572-578 (2011)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Rahul Barthwal University of Stuttgart

Lukas Bartholomäus University of Stuttgart

Dr. rer. nat. Simon Barth University of Stuttgart

Aneesh Barthakur University of Stuttgart

Alexander Bartler University of Stuttgart

 

Other publications of authors with the same name

Modeling and Control of Electrowetting Induced Droplet Motion., , and . Micromachines, 3 (1): 150-167 (2012)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology., , , , , , , , , and 27 other author(s). J. Solid-State Circuits, 46 (1): 293-307 (2011)Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging., , , , , , and . Microelectronics Reliability, 52 (11): 2677-2684 (2012)Design and implementation of flexible and stretchable systems., , , , , , , , and . Microelectronics Reliability, 51 (6): 1069-1076 (2011)Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling., , , , and . Microelectronics Journal, 39 (7): 966-974 (2008)Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling., , , , , , , , , and 2 other author(s). Microelectronics Reliability, 54 (6-7): 1200-1205 (2014)MEMS packaging and reliability: An undividable couple., , , , , , , , , and 1 other author(s). Microelectronics Reliability, 52 (9-10): 2228-2234 (2012)Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions., , , , , , , , , and 8 other author(s). CICC, page 1-4. IEEE, (2010)Cu pumping in TSVs: Effect of pre-CMP thermal budget., , , , , , , , , and . Microelectronics Reliability, 51 (9-11): 1856-1859 (2011)