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thermo-mechanical behavior of a 3D stack - Challenges and solutions.

G. der Plas, S. Thijs, D. Linten, G. Katti, P. Limaye, A. Mercha, M. Stucchi, H. Oprins, B. Vandevelde, N. Minas, M. Cupac, M. Dehan, M. Nelis, R. Agarwal, W. Dehaene, Y. Travaly, E. Beyne, and P. Marchal. CICC, page 1-4. IEEE, (2010)

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Nikolaos Karadimitriou University of Stuttgart

Data for: Formation of common preferential two-phase displacement pathways in porous mediaS. Vahid Dastjerdi, N. Karadimitriou, and H. Steeb. Dataset, (2024)Related to: Vahid Dastjerdi, S.; Karadimitriou, N.; Hassanizadeh, S. M. & Steeb, H.: Formation of common preferential two-phase displacement pathways in porous media. Water Resources Research (Submitted Jan. 2024).

Nikolaos Giannakopoulos University of Stuttgart

Michael Minas University of Stuttgart

Nikolaos Papanikolaou University of Stuttgart

Other publications of authors with the same name

In-tier diagnosis of power domains in 3D TSV ICs.Y. Araga, M. Nagata, G. der Plas, J. Kim, N. Minas, P. Marchal, Y. Travaly, M. Libois, A. Manna, W. Zhang and 1 other author(s). 3DIC, page 1-6. IEEE, (2011)Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.G. der Plas, S. Thijs, D. Linten, G. Katti, P. Limaye, A. Mercha, M. Stucchi, H. Oprins, B. Vandevelde, N. Minas and 8 other author(s). CICC, page 1-4. IEEE, (2010)Design issues and considerations for low-cost 3D TSV IC technology.G. der Plas, P. Limaye, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti, D. Velenis and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). J. Solid-State Circuits, 46 (1): 293-307 (2011)NoC Communication Strategies Using Time-to-Digital Conversion.C. D'Alessandro, N. Minas, K. Heron, D. Kinniment, and A. Yakovlev. NOCS, page 65-74. IEEE Computer Society, (2007)FPGA Implementation of an Asynchronous Processor with Both Online and Offline Testing Capabilities.N. Minas, M. Marshall, G. Russell, and A. Yakovlev. ASYNC, page 128-137. IEEE Computer Society, (2008)A High Resolution Flash Time-to-Digital Converter Taking Into Account Process Variability.N. Minas, D. Kinniment, K. Heron, and G. Russell. ASYNC, page 163-174. IEEE Computer Society, (2007)3D integration: Circuit design, test, and reliability challenges.N. Minas, I. Wolf, E. Marinissen, M. Stucchi, H. Oprins, A. Mercha, G. der Plas, D. Velenis, and P. Marchal. IOLTS, page 217. IEEE Computer Society, (2010)

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Disambiguation of "Minas, Nikolaos"

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Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

Please choose a person to relate this publication to

Nikolaos Karadimitriou University of Stuttgart

Nikolaos Giannakopoulos University of Stuttgart

Michael Minas University of Stuttgart

Nikolaos Papanikolaou University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Minas, Nikolaos"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

Please choose a person to relate this publication to

Nikolaos Karadimitriou University of Stuttgart

Nikolaos Giannakopoulos University of Stuttgart

Michael Minas University of Stuttgart

Nikolaos Papanikolaou University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.