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In-tier diagnosis of power domains in 3D TSV ICs.

Y. Araga, M. Nagata, G. der Plas, J. Kim, N. Minas, P. Marchal, Y. Travaly, M. Libois, A. Manna, W. Zhang, and E. Beyne. 3DIC, page 1-6. IEEE, (2011)

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Other publications of authors with the same name

Landside capacitor efficacy among multi-chip-module using Si-interposer.Y. Araga, R. Kasai, D. Tanaka, Y. Murakami, K. Mihara, K. Makida, H. Sonoda, M. Nagata, N. Watanabe, H. Shimamoto and 1 other author(s). IEICE Electron. Express, 18 (9): 20210070 (2021)Substrate monitoring system for inspecting defects in TSV-based data buses.Y. Araga, K. Katsuya, and M. Aoyagi. 3DIC, page 1-5. IEEE, (2014)Performance Evaluation of Probing Front-End Circuits for On-Chip Noise Monitoring.Y. Araga, N. Ueda, Y. Takagi, and M. Nagata. IEICE Transactions, 96-A (12): 2516-2523 (2013)Analysis and evaluation of noise coupling between through-silicon-vias.Y. Araga, N. Watanabe, H. Shimamoto, and K. Kikuchi. IEICE Electron. Express, 18 (11): 20210139 (2021)Guard-ring monitoring system for inspecting defects in TSV-based data buses.Y. Araga, K. Katsuya, and M. Aoyagi. 3DIC, page TS8.18.1-TS8.18.5. IEEE, (2015)A diagnosis testbench of analog IP cores against on-chip environmental disturbances.T. Hashida, Y. Araga, and M. Nagata. VTS, page 70-75. IEEE Computer Society, (2011)An on-chip waveform capturing technique pursuing minimum cost of integration.Y. Araga, T. Hashida, and M. Nagata. ISCAS, page 3557-3560. IEEE, (2010)Noise analysis using on-chip waveform monitor in bandgap voltage references.A. Murata, S. Agatsuma, D. Ikoma, K. Ichikawa, T. Tsuda, M. Nagata, K. Yoshikawa, Y. Araga, and Y. Harada. EMC Compo, page 226-231. IEEE, (2013)A study on substrate noise coupling among TSVs in 3D chip stack.Y. Araga, M. Nagata, J. Vos, G. der Plas, and E. Beyne. IEICE Electronic Express, 15 (13): 20180460 (2018)A Diagnosis Testbench of Analog IP Cores for Characterization of Substrate Coupling Strength.T. Hashida, Y. Araga, and M. Nagata. IEICE Transactions, 94-C (6): 1016-1023 (2011)

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In-tier diagnosis of power domains in 3D TSV ICs.

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Disambiguation of "Araga, Yuuki"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML In-tier diagnosis of power domains in 3D TSV ICs.

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In-tier diagnosis of power domains in 3D TSV ICs.