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Disambiguation of "Vandevelde, Bart"

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Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

, , , , , , , , , , , , , , , , , and . CICC, page 1-4. IEEE, (2010)

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Rahul Barthwal University of Stuttgart

Lukas Bartholomäus University of Stuttgart

Dr. rer. nat. Simon Barth University of Stuttgart

Aneesh Barthakur University of Stuttgart

Alexander Bartler University of Stuttgart

 

Other publications of authors with the same name

Modeling and Control of Electrowetting Induced Droplet Motion., , and . Micromachines, 3 (1): 150-167 (2012)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology., , , , , , , , , and 27 other author(s). J. Solid-State Circuits, 46 (1): 293-307 (2011)Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling., , , , and . Microelectronics Journal, 39 (7): 966-974 (2008)Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging., , , , , , and . Microelectronics Reliability, 52 (11): 2677-2684 (2012)Design and implementation of flexible and stretchable systems., , , , , , , , and . Microelectronics Reliability, 51 (6): 1069-1076 (2011)Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling., , , , , , , , , and 2 other author(s). Microelectronics Reliability, 54 (6-7): 1200-1205 (2014)MEMS packaging and reliability: An undividable couple., , , , , , , , , and 1 other author(s). Microelectronics Reliability, 52 (9-10): 2228-2234 (2012)Package and solder joint reliability analysed by FEM simulation and experiments., and . Microelectronics Reliability, 44 (12): 1891-1892 (2004)Design of metal interconnects for stretchable electronic circuits., , , , , and . Microelectronics Reliability, 48 (6): 825-832 (2008)