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Disambiguation of "Jr., John M. Carulli"

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The Impact of Multiple Failure Modes on Estimating Product Field Reliability.

, and . IEEE Design & Test of Computers, 23 (2): 118-126 (2006)

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John Nixon University of Stuttgart

Isaac Henderson Johnson Jeyakumar University of Stuttgart

David John Cross University of Stuttgart

M. Nudischer

M. Kratzer

 

Other publications of authors with the same name

Predicting die-level process variations from wafer test data for analog devices: A feasibility study., , , , , and . LATW, page 1-6. IEEE Computer Society, (2013)Spatial correlation modeling for probe test cost reduction in RF devices., , , and . ICCAD, page 23-29. ACM, (2012)Variation and failure characterization through pattern classification of test data from multiple test stages., , , , , , and . ITC, page 1-10. IEEE, (2016)IC laser trimming speed-up through wafer-level spatial correlation modeling., , , , , , and . ITC, page 1-7. IEEE Computer Society, (2014)Parametric counterfeit IC detection via Support Vector Machines., , and . DFT, page 7-12. IEEE Computer Society, (2012)Multidimensional Test Escape Rate Modeling., , , , and . IEEE Design & Test of Computers, 26 (5): 74-82 (2009)Adapting to adaptive testing., , , , , , , , and . DATE, page 556-561. IEEE, (2010)Die-level adaptive test: Real-time test reordering and elimination., , , , and . ITC, page 1-10. IEEE Computer Society, (2011)Spatial estimation of wafer measurement parameters using Gaussian process models., , , and . ITC, page 1-8. IEEE Computer Society, (2012)Handling discontinuous effects in modeling spatial correlation of wafer-level analog/RF tests., , , and . DATE, page 553-558. EDA Consortium San Jose, CA, USA / ACM DL, (2013)