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A wireless real-time on-chip bus trace system., , , , and . ASP-DAC, page 91-92. IEEE, (2009)A 6 Gb/s 6 pJ/b 5 mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and High EMC Tolerant Pulse Transceiver., , and . J. Solid-State Circuits, 51 (6): 1446-1456 (2016)Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration., , , , , , and . IEEE Trans. VLSI Syst., 19 (10): 1902-1907 (2011)Crosstalk Rejection in 3-D-Stacked Interchip Communication With Blind Source Separation., , , and . IEEE Trans. on Circuits and Systems, 62-II (8): 726-730 (2015)A 12-Gb/s Non-Contact Interface With Coupled Transmission Lines., , , , , and . J. Solid-State Circuits, 48 (3): 790-800 (2013)Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer., , , , , , , , and . VLSIC, page 82-. IEEE, (2015)An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories., , , , , , , and . J. Solid-State Circuits, 51 (4): 1041-1050 (2016)A 1 Tb/s/mm2 inductive-coupling side-by-side chip link., , , and . ESSCIRC, page 469-472. IEEE, (2016)Wireless proximity interfaces with a pulse-based inductive coupling technique., and . IEEE Communications Magazine, 48 (10): 192-199 (2010)A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface., , , , , , , , , and 1 other author(s). IEEE Micro, 33 (6): 6-15 (2013)