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mm2 inductive-coupling side-by-side chip link.

S. Hasegawa, J. Kadomoto, A. Kosuge, and T. Kuroda. ESSCIRC, page 469-472. IEEE, (2016)

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Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer.M. Ikebe, D. Uchida, Y. Take, M. Someya, S. Chikuda, K. Matsuyama, T. Asai, T. Kuroda, and M. Motomura. VLSIC, page 82-. IEEE, (2015)An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories.A. Kosuge, J. Hashiba, T. Kawajiri, S. Hasegawa, T. Shidei, H. Ishikuro, T. Kuroda, and K. Takeuchi. J. Solid-State Circuits, 51 (4): 1041-1050 (2016)A 12-Gb/s Non-Contact Interface With Coupled Transmission Lines.T. Takeya, L. Nan, S. Nakano, N. Miura, H. Ishikuro, and T. Kuroda. J. Solid-State Circuits, 48 (3): 790-800 (2013)A wireless real-time on-chip bus trace system.S. Kawai, T. Ikari, Y. Takikawa, H. Ishikuro, and T. Kuroda. ASP-DAC, page 91-92. IEEE, (2009)A 1 Tb/s/mm2 inductive-coupling side-by-side chip link.S. Hasegawa, J. Kadomoto, A. Kosuge, and T. Kuroda. ESSCIRC, page 469-472. IEEE, (2016)A 6 Gb/s 6 pJ/b 5 mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and High EMC Tolerant Pulse Transceiver.A. Kosuge, J. Kadomoto, and T. Kuroda. J. Solid-State Circuits, 51 (6): 1446-1456 (2016)Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card.A. Radecki, Y. Yuan, N. Miura, I. Aikawa, Y. Take, H. Ishikuro, and T. Kuroda. J. Solid-State Circuits, 47 (10): 2484-2495 (2012)A 9-bit 100-MS/s 1.46-mW Tri-Level SAR ADC in 65 nm CMOS.Y. Chen, S. Tsukamoto, and T. Kuroda. IEICE Transactions, 93-A (12): 2600-2608 (2010)Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO.J. Kadomoto, S. Hasegawa, Y. Kiuchi, A. Kosuge, and T. Kuroda. IEICE Transactions, 99-C (6): 659-662 (2016)Live Demonstration: A Non-Contact Transmission Line Connector for USB3.1 HD-Video Streaming.T. Arakawa, J. Sone, M. Okada, M. Hamada, and T. Kuroda. ISCAS, page 1. IEEE, (2019)

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A 1 Tb/s/mm2 inductive-coupling side-by-side chip link.

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PUMA

Disambiguation of "Kuroda, Tadahiro"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A 1 Tb/s/mm2 inductive-coupling side-by-side chip link.

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A 1 Tb/s/mm2 inductive-coupling side-by-side chip link.