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Adaptive Layout Technique for Microhybrid Integration of Chip-Film Patch

G. Alavi, H. Sailer, B. Albrecht, C. Harendt, and J. Burghartz. IEEE Transactions on Components Packaging and Manufacturing Technology, 8 (5): 802-810 (2018)
DOI: 10.1109/TCPMT.2018.2818762

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Univ. -Prof. Dr. phil. Christine Sälzer University of Stuttgart

Christine Well University of Stuttgart

Christine Freisen University of Stuttgart

Dr. Christine Richter-Nilsson University of Stuttgart

Christine Flaig

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Thermal characterization and modeling of ultra-thin silicon chips.M. Alshahed, Z. Yu, H. Rempp, H. Richter, C. Harendt, and J. Burghartz. ESSDERC, page 397-400. IEEE, (2014)Ultra-thin chips and related applications, a new paradigm in silicon technologyJ. Burghartz, W. Appel, C. Harendt, H. Rempp, H. Richter, and M. Zimmermann. 2009 Proceedings of the European Solid State Device Research Conference, page 29-36. Piscataway, New Jersey, IEEE, (2009)Hybride Systeme in Folie (HySiF) Mittels Adaptivem Layout Und LaserdirektschreiberB. Albrecht, G. Alavi, M. Hassan, S. Ferwana, H. Sailer, C. Harendt, and J. Burghartz. MikroSystemTechnik Kongress 2017 : MEMS, Mikroelektronik, Systeme 23.-25. Oktober 2017 in München, (2017)1593.Komplexe Systeme in Folien ? die Nächste Generation Intelligenter Und Flexibler FoliensubstrateS. Alina, K. Jan, S. Stefan, B. Joachim, H. Christine, H. Mahadi-Ul, F. Marcus, and K. Jürgen. page 34. (February 2016)1548.Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin ChipsS. Endler, S. Ferwana, H. Rempp, C. Harendt, and J. Burghartz. IEEE Electron Device Letters, 33 (3): 444-446 (March 2012)Imbedding Ultra-Thin Chips in PolymersM. Hassan, C. Schomburg, E. Penteker, C. Harendt, T. Hoang, and J. Burghartz. page 1-6. (2011)Smart Skin for Robotics -- an example of a Complex System-In-FoilH. Richter, J. Burghartz, M. Berroth, N. Frühauf, C. Harendt, J. Hesselbarth, G. Hübner, H. Kück, H. Klauk, J. Kostelnik and 2 other author(s). International Exhibition and Conference for the Printed Electronics Industry (LOPEC), Munich, Germany, (2017)Innovative solutions for systems based on embedding of thin components into flexible printed circuit boardsJ. Wolf, M. Alshahed, J. Burghartz, T. Gneiting, C. Harendt, J. Kostelnik, A. Kugler, and E. Lorenz. 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, page 1-4. Piscataway, NJ, IEEE, (2015)Komplexe Systeme in Folien? : Die nächste Generation intelligenter und flexibler FoliensubstrateA. Schreivogel, J. Kostelnik, S. Saller, J. Burghartz, C. Harendt, M. Hassan, M. Fritzmann, and J. Keck. Elektronische Baugruppen und Leiterplatten : EBL 2016 Multifunktionale Baugruppen - Leistungsdichte am Limit? : 8. DVD/GMM-Tagung vom 16. bis 17. Februar 2016 in Fellbach, volume 321 of DVS-Berichte, page 31-34. Düsseldorf, DVS-Verlag, (2016)Compensation pf Externally Applied Mechanical Stress by Stacking Of Ultrathin ChipsS. Endler, H. Rempp, C. Harendt, and J. Burghartz. Solid-State Electronics, (August 2012)