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Thermal characterization and modeling of ultra-thin silicon chips., , , , , and . ESSDERC, page 397-400. IEEE, (2014)Hybride Systeme in Folie (HySiF) Mittels Adaptivem Layout Und Laserdirektschreiber, , , , , , and . MikroSystemTechnik Kongress 2017 : MEMS, Mikroelektronik, Systeme 23.-25. Oktober 2017 in München, (2017)1593.Komplexe Systeme in Folien ? die Nächste Generation Intelligenter Und Flexibler Foliensubstrate, , , , , , , and . page 34. (February 2016)1548.Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips, , , , and . IEEE Electron Device Letters, 33 (3): 444-446 (March 2012)Imbedding Ultra-Thin Chips in Polymers, , , , , and . page 1-6. (2011)Ultra-thin chips and related applications, a new paradigm in silicon technology, , , , , and . 2009 Proceedings of the European Solid State Device Research Conference, page 29-36. Piscataway, New Jersey, IEEE, (2009)Smart Skin for Robotics -- an example of a Complex System-In-Foil, , , , , , , , , and 2 other author(s). International Exhibition and Conference for the Printed Electronics Industry (LOPEC), Munich, Germany, (2017)Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards, , , , , , , and . 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, page 1-4. Piscataway, NJ, IEEE, (2015)Optimized adaptive layout technique for hybrid systems in foil, , , , and . 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, Piscataway, New Jersey, IEEE, (2017)Compensation of externally applied mechanical stress by stacking of ultra-thin chips, , , and . 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 279-282. Piscataway, New Jersey, IEEE, (2011)