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Disambiguation of "Burghartz, Joachim N."

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Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

, , , , , , , and . Solid-state electronics, (2015)
DOI: 10.1016/j.sse.2015.05.023

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Univ. -Prof. Dr. -Ing. Joachim Burghartz University of Stuttgart

PD Dr. phil. Joachim Wündisch University of Stuttgart

Dr. Joachim Pfeiffer University of Stuttgart

Hon. -Prof. Dr. -Ing. Joachim Birk University of Stuttgart

Prof. Dr. -Ing. Joachim Speidel University of Stuttgart

 

Other publications of authors with the same name

Low-voltage organic transistors for flexible electronics., , , , , , , , , and 2 other author(s). DATE, page 1-6. European Design and Automation Association, (2014)Flexible Low-Voltage Organic Complementary Circuits : Finding the Optimum Combination of Semiconductors And Monolayer Gate Dielectrics, , , , , , , , and . Advanced Materials, 27 (2): 207-214 (January 2014)Ultra-Thin Sensor Systems Integrating Silicon Chips With On-Foil Passive And Active Components, , , , , , , and . EUROSENSORS 2018 Graz, Austria : 9–12 September 2018, volume 2 of Proceedings, Basel, MDPI AG, (2018)Micro-Hybrid System in Polymer Foil Based On Adaptive Layout, , , , , , and . 2016 6th Electronic System-Integration Technology Conference (ESTC), Piscataway, New Jersey, IEEE, (2016)Ultra-thin flexible 100 V Chipfilm™ N-LDMOS, , , and . 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 215-218. Piscataway, New Jersey, IEEE, (2011)A flexible stress sensor using a sub-10μm silicon chip technology, , , , and . 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), page 2628-2631. Piscataway, New Jersey, IEEE, (2013)Self-aligned through silicon vias in ultra-thin chips for 3D-integration, , , and . 2012 4th Electronic System-Integration Technology Conference, Piscataway, New Jersey, IEEE, (2012)A 3.3V 6b 100kS/s current-steering D/A converter using organic thin-film transistors on glass, , , , , , , and . 2011 IEEE International Solid-State Circuits Conference, page 324-325. Piscataway, New Jersey, IEEE, (2011)CMOS Imager Technologies for Biomedical Applications, , , , , , and . 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, page 142-143. Piscataway, New Jersey, IEEE, (2008)Through-Silicon Via Technology in Chipfilm Substrates For 3D-Integration, , , , and . page 63-66. (2011)