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Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips, , , , , , , and . Solid-state electronics, (2015)Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards, , , , , , , and . 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, page 1-4. Piscataway, NJ, IEEE, (2015)