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Stacked Ultrathin Chips with TSVs enabling 3D Flex-Sensors

S. Ferwana, S. Endler, C. Harendt, and J. Burghartz. (2012)

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Stefan Hecht University of Stuttgart

Determination and comparison of the cut resistance of different fibre ropesS. Hecht, D. Fischer, and R. Schulz. Proceedings of OIPEEC Conference 2024, page 43-59. Organisation Internationale pour l'Etude des Cables (OIPEEC), (April 2024)

Determination and comparison of the cut resistance of different fibre ropesS. Hecht, D. Fischer, and R. Schulz. Proceedings of OIPEEC Conference 2024, page 43-59. Organisation Internationale pour l'Etude des Cables (OIPEEC), (April 2024)Faserseile – neue Methoden der AblegereifeerkennungJ. Keller, F. Stegmaier, and S. Hecht. 31. Internationale Kranfachtagung 2023 - Digitalisierung, Innovation, Produktsicherheit, 31, page 89-98. Arbeitsgruppe Baumaschinen- und Fördertechnik, Ruhr-Universität Bochum, Selbstverlag der Ruhr-Universität Bochum, (May 2023)Auslegung von Seiltrieben – Lebensdauerreduktion durch GegenbiegungK. Wehking, and S. Hecht. LIFT REPORT 42. Jahrg. (2016) Heft 1, (2016)

Stefan Kunert University of Stuttgart

Stefan Schippling University of Stuttgart

Stefan Keuler University of Stuttgart

Dr. -Ing. Stefan Carosella University of Stuttgart

Other publications of authors with the same name

Compensation of externally applied mechanical stress by stacking of ultra-thin chipsS. Endler, H. Rempp, C. Harendt, and J. Burghartz. 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 279-282. Piscataway, New Jersey, IEEE, (2011)Stacked Ultrathin Chips with TSVs enabling 3D Flex-SensorsS. Ferwana, S. Endler, C. Harendt, and J. Burghartz. (2012)Ultra-thin chip technology for system-in-foil applicationsE. Angelopoulos, M. Zimmermann, W. Appel, S. Endler, S. Ferwana, C. Harendt, H. Tu, A. Pruemm, and J. Burghartz. 2010 International Electron Devices Meeting, page 2.5.1.-2.5.4.. Piscataway, New Jersey, IEEE, (2010)Training- and Contest-scheduling in Endurance Sports by Means of Course Profiles and PerPot-based Analysis.J. Perl, and S. Endler. Int. J. Comp. Sci. Sport, (2006)Bending-Stress Management by Stacking of Ultrathin Integrated Circuit ChipsS. Endler. Universität Stuttgart, Dissertation, (October 2012)Compensation pf Externally Applied Mechanical Stress by Stacking Of Ultrathin ChipsS. Endler, H. Rempp, C. Harendt, and J. Burghartz. Solid-State Electronics, (August 2012)Mechanical Stability of Ultra-Thin Chips Down to 6 ΜmC. Harendt, E. Angelopoulos, S. Endler, M. Hassan, T. Hoang, and J. Burghartz. (2010)A flexible stress sensor using a sub-10μm silicon chip technologyS. Ferwana, E. Angelopoulos, S. Endler, C. Harendt, and J. Burghartz. 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), page 2628-2631. Piscataway, New Jersey, IEEE, (2013)Packaging Challenges Associated With Warpage Of Ultra-Thin ChipsM. Hassan, E. Angelopoulos, H. Rempp, S. Endler, and J. Burghartz. 3rd Electronics System Integration Technology Conference ESTC, Piscataway, New Jersey, IEEE, (2010)Performance Estimation using the Fitness-Fatigue Model with Kalman Filter Feedback.D. Kolossa, M. Azhar, C. Rasche, S. Endler, F. Hanakam, A. Ferrauti, and M. Pfeiffer. Int. J. Comp. Sci. Sport, 16 (2): 117-129 (2017)