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Disambiguation of "Minixhofer, Rainer"

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Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures.

, , , , , and . Microelectronics Journal, 35 (10): 805-810 (2004)

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apl. Prof. Dr. Rainer Bäuerle University of Stuttgart

Rainer Goutrié University of Stuttgart

Dr. Rainer Stöhr University of Stuttgart

Rainer Kuhn University of Stuttgart

Rainer Valek University of Stuttgart

 

Other publications of authors with the same name

Scalable High Voltage CMOS technology for Smart Power and sensor applications., , , , , , , , , and . Elektrotechnik und Informationstechnik, 125 (4): 109-117 (2008)Hot-carrier reliability in high-voltage lateral double-diffused MOS transistors., , , , , , and . IET Circuits, Devices & Systems, 2 (3): 347-353 (2008)Building interchangeable black-box models of integrated circuits for EMC simulations., , , , and . EMC Compo, page 258-263. IEEE, (2015)Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures., , , , , and . Microelectronics Journal, 35 (10): 805-810 (2004)Analysis of hot carrier effects in a 0.35 µm high voltage n-channel LDMOS transistor., , , and . Microelectronics Reliability, 47 (9-11): 1439-1443 (2007)Interface traps density-of-states as a vital component for hot-carrier degradation modeling., , , , , , , , , and 4 other author(s). Microelectronics Reliability, 50 (9-11): 1267-1272 (2010)Towards probabilistic analog behavioral modeling., , , , , and . ISCAS, page 2728-2731. IEEE, (2015)Negative bias temperature instability modeling for high-voltage oxides at different stress temperatures., , , , and . Microelectronics Reliability, 47 (4-5): 697-699 (2007)FlexRay transceiver in a 0.35 µm CMOS high-voltage technology., , , , , , , , and . DATE Designers' Forum, page 201-205. European Design and Automation Association, Leuven, Belgium, (2006)