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Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures.

, , , , , and . Microelectronics Journal, 35 (10): 805-810 (2004)

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On the Topography Simulation of Memory Cell Trenches for Semiconductor Manufacturing Deposition Processes using the Level Set Method., and . ESM, page 653-660. SCS Europe, (2002)A study on global and local optimization techniques for TCAD analysis tasks., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 23 (6): 814-822 (2004)Anisotropic Mesh Refinement for the Simulation of Three-Dimensional Semiconductor Manufacturing Processes., , , , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 25 (10): 2129-2139 (2006)Multiscale Modeling of Planar and Nanowire Field-Effect Biosensors., , and . SIAM Journal of Applied Mathematics, 70 (5): 1634-1654 (2010)An algorithm for smoothing three-dimensional Monte Carlo ion implantation simulation results., , and . Mathematics and Computers in Simulation, 66 (2-3): 219-230 (2004)On the simulation of the formation and dissolution of silicon self-interstitial clusters and the corresponding inverse modeling problem., and . Microelectronics Journal, 35 (2): 167-171 (2004)On smoothing three-dimensional Monte Carlo ion implantation simulation results., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 22 (7): 879-883 (2003)Optimal design of nanowire field-effect troponin sensors., , , , , and . Comp. in Bio. and Med., (2017)Bayesian estimation of physical and geometrical parameters for nanocapacitor array biosensors., , , , , , , and . J. Comput. Physics, (2019)Homogenization of Boundary Layers in the Boltzmann-Poisson System., and . Multiscale Model. Simul., 19 (1): 506-532 (2021)