%0 Journal Article %1 journals/mj/HolzerMHFGS04 %A Holzer, Stefan %A Minixhofer, Rainer %A Heitzinger, Clemens %A Fellner, Johannes %A Grasser, Tibor %A Selberherr, Siegfried %D 2004 %J Microelectronics Journal %K dblp %N 10 %P 805-810 %T Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures. %U http://dblp.uni-trier.de/db/journals/mj/mj35.html#HolzerMHFGS04 %V 35

@article{journals/mj/HolzerMHFGS04, added-at = {2019-06-02T00:00:00.000+0200}, author = {Holzer, Stefan and Minixhofer, Rainer and Heitzinger, Clemens and Fellner, Johannes and Grasser, Tibor and Selberherr, Siegfried}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/25b35045d2e84ce65b91500b0676ce319/dblp}, ee = {https://www.wikidata.org/entity/Q62600374}, interhash = {abb6b2012231fd289f27c9fbf1f30a3c}, intrahash = {5b35045d2e84ce65b91500b0676ce319}, journal = {Microelectronics Journal}, keywords = {dblp}, number = 10, pages = {805-810}, timestamp = {2019-09-27T08:54:28.000+0200}, title = {Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures.}, url = {http://dblp.uni-trier.de/db/journals/mj/mj35.html#HolzerMHFGS04}, volume = 35, year = 2004 }