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Within Die Thermal Gradient Impact on Clock-Skew: A New Type of Delay-Fault Mechanism.

, , , , and . ITC, page 1276-1284. IEEE Computer Society, (2004)

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Test Methodologies in the Deep Submicron Era - Analog, Mixed-Signal, and RF., , , and . VLSI Design, page 12-13. IEEE Computer Society, (2005)Effectiveness of reverse body bias for leakage control in scaled dual Vt CMOS ICs., , , , , , , and . ISLPED, page 207-212. ACM, (2001)Parameter variations and impact on circuits and microarchitecture., , , , , and . DAC, page 338-342. ACM, (2003)Adaptive circuit techniques to minimize variation impacts on microprocessor performance and power., , , and . ISCAS (1), page 9-12. IEEE, (2005)Thermal Management of High Performance Microprocessors., , , and . DFT, page 313-319. IEEE Computer Society, (2003)2 GHz 2 Mb 2T Gain Cell Memory Macro With 128 GBytes/sec Bandwidth in a 65 nm Logic Process Technology., , , , , , , , , and 1 other author(s). J. Solid-State Circuits, 44 (1): 174-185 (2009)Within Die Thermal Gradient Impact on Clock-Skew: A New Type of Delay-Fault Mechanism., , , , and . ITC, page 1276-1284. IEEE Computer Society, (2004)A Fast Concurrent Power-Thermal Model for Sub-100nm Digital ICs., , , , and . DATE, page 206-211. IEEE Computer Society, (2005)Leakage and Process Variation Effects in Current Testing on Future CMOS Circuits., , , , , , , and . IEEE Des. Test Comput., 19 (5): 36-43 (2002)2GHz 2Mb 2T Gain-Cell Memory Macro with 128GB/s Bandwidth in a 65nm Logic Process., , , , , , , , , and 1 other author(s). ISSCC, page 274-275. IEEE, (2008)