Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Hybride Systeme in Folie (HySiF) Mittels Adaptivem Layout Und Laserdirektschreiber

B. Albrecht, G. Alavi, M. Hassan, S. Ferwana, H. Sailer, C. Harendt, and J. Burghartz. MikroSystemTechnik Kongress 2017 : MEMS, Mikroelektronik, Systeme 23.-25. Oktober 2017 in München, (2017)1593.

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Dr. -Ing. Hassan Gomaa University of Stuttgart

Asmaa Hassan University of Stuttgart

Hassan Hayeri University of Stuttgart

Mohamed Hassan University of Stuttgart

Muhammad Khubaib ul Hassan Khan University of Stuttgart

Other publications of authors with the same name

Hybride Systeme in Folie (HySiF) Mittels Adaptivem Layout Und LaserdirektschreiberB. Albrecht, G. Alavi, M. Hassan, S. Ferwana, H. Sailer, C. Harendt, and J. Burghartz. MikroSystemTechnik Kongress 2017 : MEMS, Mikroelektronik, Systeme 23.-25. Oktober 2017 in München, (2017)1593.Automatic Categorization of Traditional Clothing Using Convolutional Neural Network.M. Nawaz, R. Hasan, M. Hasan, M. Hassan, and R. Rahman. ICIS, page 98-103. IEEE Computer Society, (2018)Application Of BCB-On-Si Based Substrate in Combining Flexible Organic Electronics And High Frequency AntennaM. Elsobky, G. Alavi, U. Zschieschang, M. Aghamohammadi, M. Hassan, H. Klauk, C. Harendt, H. Richter, and J. Burghartz. (2016)Stress Analysis of Ultra-Thin Silicon Chip-On-Foil Electronic Assembly under BendingN. Wacker, H. Richter, T. Hoang, P. Gazdzicki, M. Schulze, E. Angelopoulos, M. Hassan, and J. Burghartz. (August 2014)Ultradünne Chips in Flexibler ElektronikS. Endler, E. Angelopoulos, S. Ferwana, C. Harendt, M. Hassan, and J. Burghartz. Elektronische Baugruppen und Leiterplatten : EBL 2012 : Hochentwickelte Baugruppen in Europa, page 73-77. Düsseldorf, DVS Media, (February 2012)Manufacturing aspects of an ultra-thin chip technologyE. Angelopoulos, M. Alshahed, W. Appel, S. Endler, S. Ferwana, C. Harendt, M. Hassan, H. Rempp, M. Zimmermann, and J. Burghartz. 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 141-144. Piscataway, New Jersey, IEEE, (2012)Komplexe Systeme in Folien ? die Nächste Generation Intelligenter Und Flexibler FoliensubstrateS. Alina, K. Jan, S. Stefan, B. Joachim, H. Christine, H. Mahadi-Ul, F. Marcus, and K. Jürgen. page 34. (February 2016)1548.Imbedding Ultra-Thin Chips in PolymersM. Hassan, C. Schomburg, E. Penteker, C. Harendt, T. Hoang, and J. Burghartz. page 1-6. (2011)The Most Advantageous Bangla Keyboard Layout Using Data Mining TechniqueA. Masum, M. Hassan, and S. Kamruzzaman. CoRR, (2010)Optimal Bangla Keyboard Layout using Data Mining TechniqueS. Kamruzzaman, M. Alam, A. Masum, and M. Hassan. CoRR, (2010)