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Komplexe Systeme in Folien ? die Nächste Generation Intelligenter Und Flexibler Foliensubstrate

S. Alina, K. Jan, S. Stefan, B. Joachim, H. Christine, H. Mahadi-Ul, F. Marcus, and K. Jürgen. page 34. (February 2016)1548.

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Stefan Hecht University of Stuttgart

Determination and comparison of the cut resistance of different fibre ropesS. Hecht, D. Fischer, and R. Schulz. Proceedings of OIPEEC Conference 2024, page 43-59. Organisation Internationale pour l'Etude des Cables (OIPEEC), (April 2024)

Determination and comparison of the cut resistance of different fibre ropesS. Hecht, D. Fischer, and R. Schulz. Proceedings of OIPEEC Conference 2024, page 43-59. Organisation Internationale pour l'Etude des Cables (OIPEEC), (April 2024)Faserseile – neue Methoden der AblegereifeerkennungJ. Keller, F. Stegmaier, and S. Hecht. 31. Internationale Kranfachtagung 2023 - Digitalisierung, Innovation, Produktsicherheit, 31, page 89-98. Arbeitsgruppe Baumaschinen- und Fördertechnik, Ruhr-Universität Bochum, Selbstverlag der Ruhr-Universität Bochum, (May 2023)Auslegung von Seiltrieben – Lebensdauerreduktion durch GegenbiegungK. Wehking, and S. Hecht. LIFT REPORT 42. Jahrg. (2016) Heft 1, (2016)

Stefan Kunert University of Stuttgart

Stefan Schippling University of Stuttgart

Stefan Keuler University of Stuttgart

Dr. -Ing. Stefan Carosella University of Stuttgart

Other publications of authors with the same name

Untersuchung ultradünner Silizium-Chips in flexiblen Foliensystemen für die sensorische Anwendung im industriellen UmfeldS. Saller. Universität Stuttgart, Stuttgart, Dissertation, (2023)Komplexe Systeme in Folien? : Die nächste Generation intelligenter und flexibler FoliensubstrateA. Schreivogel, J. Kostelnik, S. Saller, J. Burghartz, C. Harendt, M. Hassan, M. Fritzmann, and J. Keck. Elektronische Baugruppen und Leiterplatten : EBL 2016 Multifunktionale Baugruppen - Leistungsdichte am Limit? : 8. DVD/GMM-Tagung vom 16. bis 17. Februar 2016 in Fellbach, volume 321 of DVS-Berichte, page 31-34. Düsseldorf, DVS-Verlag, (2016)Hybrid Systems in Foil (HySiF) Exploiting Ultra-Thin Flexible ChipsC. Harendt, J. Kostelnik, A. Kugler, S. Saller, Z. Yu, and J. Burghartz. 2014 44th European Solid State Device Research Conference (ESSDERC), page 210-213. Piscataway, New Jersey, IEEE, (2014)An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper.Y. Mahsereci, S. Saller, H. Richter, and J. Burghartz. J. Solid-State Circuits, 51 (1): 273-280 (2016)Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chipsC. Harendt, J. Kostelnik, A. Kugler, E. Lorenz, S. Saller, A. Schreivogel, Z. Yu, and J. Burghartz. Solid-state electronics, (2015)Combining organic and printed electronics in hybrid system in foil (HySiF) based smart skin for robotic applicationsM. Hassan, J. Keck, H. Klauk, J. Kostelnik, Y. Mahsereci, S. Saller, A. Schreivogel, T. Zaki, and J. Burghartz. 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015, page 1-6. Piscataway, NJ, IEEE, (2015)Komplexe Systeme in Folien ? die Nächste Generation Intelligenter Und Flexibler FoliensubstrateS. Alina, K. Jan, S. Stefan, B. Joachim, H. Christine, H. Mahadi-Ul, F. Marcus, and K. Jürgen. page 34. (February 2016)1548.Smart Skin for Robotics -- an example of a Complex System-In-FoilH. Richter, J. Burghartz, M. Berroth, N. Frühauf, C. Harendt, J. Hesselbarth, G. Hübner, H. Kück, H. Klauk, J. Kostelnik and 2 other author(s). International Exhibition and Conference for the Printed Electronics Industry (LOPEC), Munich, Germany, (2017)An ultra-thin flexible CMOS stress sensor demonstrated on an adaptive robotic gripperY. Mahsereci, S. Saller, H. Richter, and J. Burghartz. 2015 IEEE International Solid-State Circuits Conference (ISSCC 2015), page 1-3. Piscataway, NJ, IEEE, (2015)