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Application Of BCB-On-Si Based Substrate in Combining Flexible Organic Electronics And High Frequency Antenna, , , , , , , , and . (2016)Stress Analysis of Ultra-Thin Silicon Chip-On-Foil Electronic Assembly under Bending, , , , , , , and . (August 2014)Ultradünne Chips in Flexibler Elektronik, , , , , and . Elektronische Baugruppen und Leiterplatten : EBL 2012 : Hochentwickelte Baugruppen in Europa, page 73-77. Düsseldorf, DVS Media, (February 2012)Manufacturing aspects of an ultra-thin chip technology, , , , , , , , , and . 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 141-144. Piscataway, New Jersey, IEEE, (2012)Komplexe Systeme in Folien ? die Nächste Generation Intelligenter Und Flexibler Foliensubstrate, , , , , , , and . page 34. (February 2016)1548.Imbedding Ultra-Thin Chips in Polymers, , , , , and . page 1-6. (2011)Ultra-Thin Chip embedding and interconnect technology for System-in-Foil applications. Universität Stuttgart, Aachen, Dissertation, (2017)Combining organic and printed electronics in hybrid system in foil (HySiF) based smart skin for robotic applications, , , , , , , , and . 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015, page 1-6. Piscataway, NJ, IEEE, (2015)Komplexe Systeme in Folien? : Die nächste Generation intelligenter und flexibler Foliensubstrate, , , , , , , and . Elektronische Baugruppen und Leiterplatten : EBL 2016 Multifunktionale Baugruppen - Leistungsdichte am Limit? : 8. DVD/GMM-Tagung vom 16. bis 17. Februar 2016 in Fellbach, volume 321 of DVS-Berichte, page 31-34. Düsseldorf, DVS-Verlag, (2016)Mechanical Stability of Ultra-Thin Chips Down to 6 Μm, , , , , and . (2010)