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Manufacturing aspects of an ultra-thin chip technology

E. Angelopoulos, M. Alshahed, W. Appel, S. Endler, S. Ferwana, C. Harendt, M. Hassan, H. Rempp, M. Zimmermann, and J. Burghartz. 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 141-144. Piscataway, New Jersey, IEEE, (2012)
DOI: 10.1109/ESSDERC.2012.6343353

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Daniel Appel University of Stuttgart

Jason Kennedy Appelbaum University of Stuttgart

Univ. -Prof. Dr. -Ing. Wolfgang Rheinheimer University of Stuttgart

Univ. -Prof. Dr. Wolfgang Kühnel University of Stuttgart

apl. Prof. Dr. Wolfgang Hauber University of Stuttgart

Other publications of authors with the same name

Ultra-thin chip technology for system-in-foil applicationsE. Angelopoulos, M. Zimmermann, W. Appel, S. Endler, S. Ferwana, C. Harendt, H. Tu, A. Pruemm, and J. Burghartz. 2010 International Electron Devices Meeting, page 2.5.1.-2.5.4.. Piscataway, New Jersey, IEEE, (2010)Ultra-thin chips and related applications, a new paradigm in silicon technologyJ. Burghartz, W. Appel, C. Harendt, H. Rempp, H. Richter, and M. Zimmermann. 2009 Proceedings of the European Solid State Device Research Conference, page 29-36. Piscataway, New Jersey, IEEE, (2009)Manufacturing aspects of an ultra-thin chip technologyE. Angelopoulos, M. Alshahed, W. Appel, S. Endler, S. Ferwana, C. Harendt, M. Hassan, H. Rempp, M. Zimmermann, and J. Burghartz. 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 141-144. Piscataway, New Jersey, IEEE, (2012)Ultra-Thin Chip Fabrication and Assembly ProcessM. Zimmermann, W. Appel, J. Burghartz, S. Ferwana, and C. Harendt. Proceedings : SAFE 2008, ProRISC 2008 : 11th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors : 19th Annual Workshop on Circuits, Systems and Signal Processing : November 27 - 28, 2008, Veldhoven, The Netherlands, page 531-534. Utrecht, STW, (2008)Erstellung eines Studieninformationssystems basierend auf Lotus Notes.W. Appel, C. Schwaab, and F. Schwarz. Wirtschaftsinformatik, 38 (6): 646-647 (1996)

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Disambiguation of "Appel, Wolfgang"

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Manufacturing aspects of an ultra-thin chip technology

Please choose a person to relate this publication to

Daniel Appel University of Stuttgart

Jason Kennedy Appelbaum University of Stuttgart

Univ. -Prof. Dr. -Ing. Wolfgang Rheinheimer University of Stuttgart

Univ. -Prof. Dr. Wolfgang Kühnel University of Stuttgart

apl. Prof. Dr. Wolfgang Hauber University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Appel, Wolfgang"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Manufacturing aspects of an ultra-thin chip technology

Please choose a person to relate this publication to

Daniel Appel University of Stuttgart

Jason Kennedy Appelbaum University of Stuttgart

Univ. -Prof. Dr. -Ing. Wolfgang Rheinheimer University of Stuttgart

Univ. -Prof. Dr. Wolfgang Kühnel University of Stuttgart

apl. Prof. Dr. Wolfgang Hauber University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Manufacturing aspects of an ultra-thin chip technology