%0 Journal Article %1 wacker2014stress %A Wacker, Nicoleta %A Richter, Harald %A Hoang, Tu %A Gazdzicki, Pawel %A Schulze, Mathias %A Angelopoulos, Evangelos %A Hassan, Mahadi-Ul %A Burghartz, Joachim N. %C Bristol %D 2014 %I IOP Publishing %K INES pagesmissing %N 9 %R 10.1088/0268-1242/29/9/095007 %T Stress Analysis of Ultra-Thin Silicon Chip-On-Foil Electronic Assembly under Bending %V 29

@article{wacker2014stress, added-at = {2019-03-06T18:45:08.000+0100}, address = {Bristol}, author = {Wacker, Nicoleta and Richter, Harald and Hoang, Tu and Gazdzicki, Pawel and Schulze, Mathias and Angelopoulos, Evangelos and Hassan, Mahadi-Ul and Burghartz, Joachim N.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2f727c9c583a05c6e33b8cf49cef07d8a/kevin.konnerth}, doi = {10.1088/0268-1242/29/9/095007}, interhash = {93141793005e18e2003e3c86f623236d}, intrahash = {f727c9c583a05c6e33b8cf49cef07d8a}, issn = {0268-1242}, keywords = {INES pagesmissing}, month = {8}, number = 9, publisher = {IOP Publishing}, timestamp = {2019-03-12T14:17:24.000+0100}, title = {Stress Analysis of Ultra-Thin Silicon Chip-On-Foil Electronic Assembly under Bending}, volume = 29, year = 2014 }