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Combining organic and printed electronics in hybrid system in foil (HySiF) based smart skin for robotic applications

, , , , , , , , and . 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015, page 1-6. Piscataway, NJ, IEEE, (2015)

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