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Disambiguation of "de Crecy, François"

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Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

, , , , , , , , , , , and . 3DIC, page 1-7. IEEE, (2013)

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Davi Francois University of Stuttgart

Jörg Desel

Das ist Informatik (Eds.) Springer, (2001)

Univ. -Prof. Dr. Gerd de Bruyn University of Stuttgart

Anda Degeratu University of Stuttgart

Daniel Del Gaudio University of Stuttgart

 

Other publications of authors with the same name

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits., , , , , , , , , and 6 other author(s). IEEE Design & Test, 33 (3): 21-36 (2016)An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling., , , , , , , , , and 5 other author(s). 3DIC, page 1-4. IEEE, (2009)Using TSVs for thermal mitigation in 3D circuits: Wish and truth., , , , , , , , , and 1 other author(s). 3DIC, page 1-8. IEEE, (2014)Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects., , , , , , and . Microelectronics Reliability, 47 (4-5): 769-772 (2007)Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration., , , , , , , , , and 2 other author(s). 3DIC, page 1-7. IEEE, (2013)Thermal correlation between measurements and FEM simulations in 3D ICs., , , , , , , , , and 4 other author(s). 3DIC, page 1-6. IEEE, (2013)