%0 Conference Paper %1 conf/3dic/JoblotFHJCGAFCFLC13 %A Joblot, Sylvain %A Farcy, Alexis %A Hotellier, Nicolas %A Jouve, Amadine %A de Crecy, François %A Garnier, Arnaud %A Argoud, M. %A Ferrandon, C. %A Colonna, J.-P. %A Franiatte, R. %A Laviron, C. %A Cheramy, Séverine %B 3DIC %D 2013 %I IEEE %K dblp %P 1-7 %T Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#JoblotFHJCGAFCFLC13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/JoblotFHJCGAFCFLC13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Joblot, Sylvain and Farcy, Alexis and Hotellier, Nicolas and Jouve, Amadine and de Crecy, François and Garnier, Arnaud and Argoud, M. and Ferrandon, C. and Colonna, J.-P. and Franiatte, R. and Laviron, C. and Cheramy, Séverine}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/273de12c4e678a65dddf97f4a81e53707/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702394}, interhash = {46ceee12632444c95f4587b7e547d509}, intrahash = {73de12c4e678a65dddf97f4a81e53707}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-7}, publisher = {IEEE}, timestamp = {2019-09-27T13:40:43.000+0200}, title = {Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#JoblotFHJCGAFCFLC13}, year = 2013 }